说明
METAL (CU)配置
ElectroplatingOEM 型号描述
The SABRE Extreme, an advanced Electrofill system that has been qualified at 45 nanometers and has demonstrated fill at 32 nanometers. The SABRE Extreme incorporates a number of technological innovations for advanced manufacturing applications, including advanced wafer entry control for thin seed layers (< 200A), tunable profile control for improved uniformities, and the capability to plate on non-copper seed materials.文件
无文件
LAM RESEARCH / NOVELLUS
SABRE EXTREME
已验证
类别
Electro Plating
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
91060
晶圆尺寸：
12"/300mm
年份：
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / NOVELLUS
SABRE EXTREME
类别
Electro Plating
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
91060
晶圆尺寸：
12"/300mm
年份：
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
METAL (CU)配置
ElectroplatingOEM 型号描述
The SABRE Extreme, an advanced Electrofill system that has been qualified at 45 nanometers and has demonstrated fill at 32 nanometers. The SABRE Extreme incorporates a number of technological innovations for advanced manufacturing applications, including advanced wafer entry control for thin seed layers (< 200A), tunable profile control for improved uniformities, and the capability to plate on non-copper seed materials.文件
无文件