说明
无说明配置
Cu Plating.OEM 型号描述
The LT-210 is a single substrate processor that provides a fully automated platform for high throughput production of Cu Interconnect devices. It utilizes Semitool’s advanced electrochemical deposition technology to achieve this. The LT-210 is capable of electrochemical deposition (ECD) of materials such as Copper, Gold, and Solder for Cu Dual Damascene processes. This makes it an ideal tool for the production of high-quality interconnect devices.文件
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SEMITOOL
LT-210
已验证
类别
Electro Plating
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
34499
晶圆尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LT-210
类别
Electro Plating
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
34499
晶圆尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Cu Plating.OEM 型号描述
The LT-210 is a single substrate processor that provides a fully automated platform for high throughput production of Cu Interconnect devices. It utilizes Semitool’s advanced electrochemical deposition technology to achieve this. The LT-210 is capable of electrochemical deposition (ECD) of materials such as Copper, Gold, and Solder for Cu Dual Damascene processes. This makes it an ideal tool for the production of high-quality interconnect devices.文件
无文件