说明
无说明配置
B/IOEM 型号描述
High-Power Burn-In System For 150-Watt VLSI Devices Micro Control Company announces its new HPB-2 high-power burn-in system. The HPB-2 was designed to meet the challenge of wide variations in heat dissipation and the diverse burn-in needs created by high-power VLSI devices of up to 150 watts. The HPB-2 provides precise, individual temperature control for each device under test while supporting a wide range of test strategies. Features -Burn-in and test up to 150-watt VLSI devices -Individual device under test temperature control to within ±3˚ C -128 I/O channels per driver/receiver -Programmable temperature control from 50˚ C to 150˚ C -ASIC architecture for per-pin timing, testing, and formatting -Timing on the fly, programmable edges and rep-rate with 10-nanosecond -resolution -8 vector formats per pin per cycle -Up to 50 amps of programmable power to the device under test -Clock rate of 2 to 400 MHz, programmable文件
无文件
MICRO CONTROL COMPANY / MCC
HPB-2
已验证
类别
Electronic Test
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
102916
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
MICRO CONTROL COMPANY / MCC
HPB-2
类别
Electronic Test
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
102916
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
B/IOEM 型号描述
High-Power Burn-In System For 150-Watt VLSI Devices Micro Control Company announces its new HPB-2 high-power burn-in system. The HPB-2 was designed to meet the challenge of wide variations in heat dissipation and the diverse burn-in needs created by high-power VLSI devices of up to 150 watts. The HPB-2 provides precise, individual temperature control for each device under test while supporting a wide range of test strategies. Features -Burn-in and test up to 150-watt VLSI devices -Individual device under test temperature control to within ±3˚ C -128 I/O channels per driver/receiver -Programmable temperature control from 50˚ C to 150˚ C -ASIC architecture for per-pin timing, testing, and formatting -Timing on the fly, programmable edges and rep-rate with 10-nanosecond -resolution -8 vector formats per pin per cycle -Up to 50 amps of programmable power to the device under test -Clock rate of 2 to 400 MHz, programmable文件
无文件