RIE set up for SiO2 Etch

330mm Platen

RF Generator:  Advanced Energy RFX 600A ;  600W, 13.56MHz, 

Chamber Turbo pump: Alcatel ATH 400M  w/ ACT 600M controller

Blue color PLC type

Water cooled electrode 10C-80C

Gas pod with 6 lines including following MFCs:
Ar      - 100sccm
N2     - 200sccm
CHF3 - 200sccm
NF3   - 200sccm
N2O  - 200sccm

Windows PC , user friendly interface

Ebara Roughing pumps were utilized by previous user (NOT INCLUDED)

Lauda WK1200 Chiller was utilized by previous user (NOT INCLUDED)

OXFORD

The Oxford Plasmalab 133 is a system used for plasma etching through a process called Reactive Ion Etching (RIE). This refurbished system is designed for GaN etching and has a platen that measures 330mm. It has an RF power of 600W at a frequency of 13.56MHz and features a water-cooled electrode that can operate within a temperature range of 10°C to 80°C. The system also includes a load lock with a turbo pump and an end-point detection system that utilizes Verity Optical emission spectroscopy within the range of 200-800nm. The gas pod of the system has six lines, including mass flow controllers for gases such as Ar, CL, BCL3, and N2O.

OXFORD

PLASMALAB 133

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