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SRM XD 244
    说明
    Wafer Testing And Metrology
    配置
    无配置
    OEM 型号描述
    XD244 Tube Input Precision Component Handling System - a game-changing solution for semiconductor manufacturing. Designed to handle a versatile range of packages, including TSSOP 14-38, SOIC, MSOP, D-PAK, TO220, and QFN/MLP, this high-performance model achieves an impressive 28K UPH. Operating with a stackable tube loader for input and a tape and reel output, it offers 4 test sites and the option for advanced vision systems, including Mark & Orientation or PVI, 3D Lead or Bottom Pad or 5S, and 2D In-Pocket Mark/Orientation.
    文件

    无文件

    PREFERRED
     
    SELLER
    verified-listing-icon

    已验证

    类别
    Final Test

    上次验证: 60 多天前

    Buyer pays 12% premium of final sale price
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    101274


    晶圆尺寸:

    2"/50mm


    年份:

    2023


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    PREFERRED
     
    SELLER

    SRM

    XD 244

    verified-listing-icon
    已验证
    类别
    Final Test
    上次验证: 60 多天前
    listing-photo-a8f55f48488f4800b5d20687b71d8867-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/75657/a8f55f48488f4800b5d20687b71d8867/38025752d3bd4d37b031a4bde0700510_1_mw.png
    listing-photo-a8f55f48488f4800b5d20687b71d8867-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/75657/a8f55f48488f4800b5d20687b71d8867/917a714d115c43f6beba5ec1a8aba937_2_mw.png
    Buyer pays 12% premium of final sale price
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    101274


    晶圆尺寸:

    2"/50mm


    年份:

    2023


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Wafer Testing And Metrology
    配置
    无配置
    OEM 型号描述
    XD244 Tube Input Precision Component Handling System - a game-changing solution for semiconductor manufacturing. Designed to handle a versatile range of packages, including TSSOP 14-38, SOIC, MSOP, D-PAK, TO220, and QFN/MLP, this high-performance model achieves an impressive 28K UPH. Operating with a stackable tube loader for input and a tape and reel output, it offers 4 test sites and the option for advanced vision systems, including Mark & Orientation or PVI, 3D Lead or Bottom Pad or 5S, and 2D In-Pocket Mark/Orientation.
    文件

    无文件