说明
无说明配置
EDS/ TESTOEM 型号描述
Catalyst is a test system that delivers full test coverage for a wide range of semiconductor applications, including xDSL, wireless/RF, networking, and power management. It was the first SOC test system and is now the world’s leading SOC test system with over 1600 systems installed at customers around the world. The Catalyst family extends its range to more pins and Gigahertz speed with the Teradyne Tiger™ test system. It features fully integrated analog and digital instrumentation, mixed-signal/SOC digital with data rates to 400 Mbps, full spectrum AC instrumentation, Background-DSP™ processing, IMAGE™ programming system with interactive debug displays and complete test engineering tools for device characterization, and a system architecture that accelerates test development and high-volume production for ICs with complex digital, embedded memory, and high-performance analog components.文件
无文件
TERADYNE
CATALYST
已验证
类别
Final Test
上次验证： 昨天
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116757
晶圆尺寸：
8"/200mm, 12"/300mm
年份：
1998
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部
TERADYNE
CATALYST
类别
Final Test
上次验证： 昨天
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116757
晶圆尺寸：
8"/200mm, 12"/300mm
年份：
1998
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
EDS/ TESTOEM 型号描述
Catalyst is a test system that delivers full test coverage for a wide range of semiconductor applications, including xDSL, wireless/RF, networking, and power management. It was the first SOC test system and is now the world’s leading SOC test system with over 1600 systems installed at customers around the world. The Catalyst family extends its range to more pins and Gigahertz speed with the Teradyne Tiger™ test system. It features fully integrated analog and digital instrumentation, mixed-signal/SOC digital with data rates to 400 Mbps, full spectrum AC instrumentation, Background-DSP™ processing, IMAGE™ programming system with interactive debug displays and complete test engineering tools for device characterization, and a system architecture that accelerates test development and high-volume production for ICs with complex digital, embedded memory, and high-performance analog components.文件
无文件