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TERADYNE microFLEX
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The microFLEX test system is a smaller version of the FLEX test system, with a zero-footprint “tester in a test head” design. It is well-suited for consumer, wireless, and automotive device testing, and its small size makes it ideal for installations with limited floor space. The microFLEX system offers cost-efficient testing up to 200 MHz and is ideal for analog, digital, and mixed-signal System-on-a-Chip (SoC) and System-in-Package (SiP) device testing applications. It has a broad range of instruments to choose from and offers instrument and DIB compatibility with the FLEX test system. The system’s smaller air-cooled test head has 12 universal slots to accommodate a range of instruments and can easily be reconfigured for different test strategies. An optional small-footprint 19” rack cabinet accommodates third-party instruments, such as those used in microwave test applications. The small footprint of the microFLEX system saves floor space as system resources such as the power distribution unit, test computer, and clock reference are located in the test head itself, eliminating the need for a separate mainframe cabinet.
    文件

    无文件

    TERADYNE

    microFLEX

    verified-listing-icon

    已验证

    类别
    Final Test

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    106139


    晶圆尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    TERADYNE microFLEX

    TERADYNE

    microFLEX

    Final Test
    年份: 0状况: 二手
    上次验证60 多天前

    TERADYNE

    microFLEX

    verified-listing-icon
    已验证
    类别
    Final Test
    上次验证: 60 多天前
    listing-photo-597d7381f02746d6a6c943c6db98dbc5-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    106139


    晶圆尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    The microFLEX test system is a smaller version of the FLEX test system, with a zero-footprint “tester in a test head” design. It is well-suited for consumer, wireless, and automotive device testing, and its small size makes it ideal for installations with limited floor space. The microFLEX system offers cost-efficient testing up to 200 MHz and is ideal for analog, digital, and mixed-signal System-on-a-Chip (SoC) and System-in-Package (SiP) device testing applications. It has a broad range of instruments to choose from and offers instrument and DIB compatibility with the FLEX test system. The system’s smaller air-cooled test head has 12 universal slots to accommodate a range of instruments and can easily be reconfigured for different test strategies. An optional small-footprint 19” rack cabinet accommodates third-party instruments, such as those used in microwave test applications. The small footprint of the microFLEX system saves floor space as system resources such as the power distribution unit, test computer, and clock reference are located in the test head itself, eliminating the need for a separate mainframe cabinet.
    文件

    无文件

    类似上架物品
    查看全部
    TERADYNE microFLEX

    TERADYNE

    microFLEX

    Final Test年份: 0状况: 二手上次验证:60 多天前
    TERADYNE microFLEX

    TERADYNE

    microFLEX

    Final Test年份: 0状况: 二手上次验证:60 多天前
    TERADYNE microFLEX

    TERADYNE

    microFLEX

    Final Test年份: 0状况: 二手上次验证:60 多天前