说明
Flip Chip Bonder配置
无配置OEM 型号描述
Based on the industrial benchmark Datacon QUANTUM series, production speed was significantly increased compared to the successful Datacon FC QUANTUM advanced to offer an unprecedented Cost of Ownership. At the same time, no compromise on 4μm accuracy and process control was made to enable tool-to-tool repeatability at highest yield. - Versatile High Speed Flip Chip Bonder - Unique Quattro Concept - Accuracy ± 4μm @ 3σ - UPH up to 16,000文件
无文件
类别
Flip Chip Bonders
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
135122
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / DATACON
8800 FC QUANTUM hs
类别
Flip Chip Bonders
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
135122
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Flip Chip Bonder配置
无配置OEM 型号描述
Based on the industrial benchmark Datacon QUANTUM series, production speed was significantly increased compared to the successful Datacon FC QUANTUM advanced to offer an unprecedented Cost of Ownership. At the same time, no compromise on 4μm accuracy and process control was made to enable tool-to-tool repeatability at highest yield. - Versatile High Speed Flip Chip Bonder - Unique Quattro Concept - Accuracy ± 4μm @ 3σ - UPH up to 16,000文件
无文件