说明
Used for die attach bonding Complete, working condition. Optics: Field of view: 3.8mm x 2.7mm (general) Optical resolution: 1μm/px Accuracy: Placement: 0.3μm @ 3 Sigma Alignment: 0.08μm Alignment camera with pattern recognition FOV 3mmx4mm配置
UV Curing Module (3355-23) Dispense Module Laser Height Sensor Bond Force: 0.2N-15NOEM 型号描述
未提供文件
无文件
类别
Flip Chip Bonders
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
150786
晶圆尺寸：
未知
年份：
2023
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
FINETECH INC
FINEPLACER femto 2
类别
Flip Chip Bonders
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
150786
晶圆尺寸：
未知
年份：
2023
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Used for die attach bonding Complete, working condition. Optics: Field of view: 3.8mm x 2.7mm (general) Optical resolution: 1μm/px Accuracy: Placement: 0.3μm @ 3 Sigma Alignment: 0.08μm Alignment camera with pattern recognition FOV 3mmx4mm配置
UV Curing Module (3355-23) Dispense Module Laser Height Sensor Bond Force: 0.2N-15NOEM 型号描述
未提供文件
无文件