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SUSS MicroTec / KARL SUSS FC-150
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    Available as a completely automated system to level, align and package components down to 200 µm, the FC150 supports the complete range of bonding applications, including optoelectronics and MCM. The SUSS FC150 Bonder offers you the latest evolution in bonding technologies: ultrasonic/thermo-sonic, laser welding. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The FC150 can be equipped with tooling enabling all known bonding processes (i.e. Thermocompression, Adhesives, Reflow...) to perform wafer-to-wafer bonding, with round or square substrate sizes up to 100 mm diameter at +/- 1 µm post-bonding accuracy Flip Chip Bonder
    文件

    无文件

    类别
    Flip Chip Bonders

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    120144


    晶圆尺寸:

    未知


    年份:

    2000


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    SUSS MicroTec / KARL SUSS

    FC-150

    verified-listing-icon
    已验证
    类别
    Flip Chip Bonders
    上次验证: 60 多天前
    listing-photo-6f54ffe0c15c4aea865ff62804650ae4-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    120144


    晶圆尺寸:

    未知


    年份:

    2000


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    无说明
    配置
    无配置
    OEM 型号描述
    Available as a completely automated system to level, align and package components down to 200 µm, the FC150 supports the complete range of bonding applications, including optoelectronics and MCM. The SUSS FC150 Bonder offers you the latest evolution in bonding technologies: ultrasonic/thermo-sonic, laser welding. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The FC150 can be equipped with tooling enabling all known bonding processes (i.e. Thermocompression, Adhesives, Reflow...) to perform wafer-to-wafer bonding, with round or square substrate sizes up to 100 mm diameter at +/- 1 µm post-bonding accuracy Flip Chip Bonder
    文件

    无文件