We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 阅读更多
说明
无说明配置
FLIP CHIP BONDER Volts: 110 AMPS: 8 Phase 1, HZ 50/60OEM 型号描述
Flip Chip Bonder文件
无文件
类别
Flip Chip Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Refurbished
运行状况:
Installed / Running
产品编号：
110112
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SEMICONDUCTOR EQUIPMENT CORP. (SEC)
860 EAGLE
类别
Flip Chip Bonders
上次验证： 60 多天前
物品主要详细信息
状况：
Refurbished
运行状况:
Installed / Running
产品编号：
110112
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
FLIP CHIP BONDER Volts: 110 AMPS: 8 Phase 1, HZ 50/60OEM 型号描述
Flip Chip Bonder文件
无文件