说明
无说明配置
FLIP CHIP BONDER Volts: 110 AMPS: 8 Phase 1, HZ 50/60OEM 型号描述
Flip Chip Bonder文件
无文件
SEMICONDUCTOR EQUIPMENT CORP. (SEC)
860 EAGLE
已验证
类别
Flip Chip Bonders
上次验证: 60 多天前
物品主要详细信息
状况:
Refurbished
运行状况:
Installed / Running
产品编号:
110112
晶圆尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SEMICONDUCTOR EQUIPMENT CORP. (SEC)
860 EAGLE
类别
Flip Chip Bonders
上次验证: 60 多天前
物品主要详细信息
状况:
Refurbished
运行状况:
Installed / Running
产品编号:
110112
晶圆尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
FLIP CHIP BONDER Volts: 110 AMPS: 8 Phase 1, HZ 50/60OEM 型号描述
Flip Chip Bonder文件
无文件