说明
Repair needed - Z axis bond head not moving Any spare parts sets?: Yes配置
无配置OEM 型号描述
Flip Chip Bonder文件
无文件
SEMICONDUCTOR EQUIPMENT CORP. (SEC)
860 EAGLE
已验证
类别
Flip Chip Bonders
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
111137
晶圆尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SEMICONDUCTOR EQUIPMENT CORP. (SEC)
860 EAGLE
类别
Flip Chip Bonders
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
111137
晶圆尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Repair needed - Z axis bond head not moving Any spare parts sets?: Yes配置
无配置OEM 型号描述
Flip Chip Bonder文件
无文件