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SCIENTIFIC SEALING TECHNOLOGY / SST 3130
  • SCIENTIFIC SEALING TECHNOLOGY / SST 3130
  • SCIENTIFIC SEALING TECHNOLOGY / SST 3130
  • SCIENTIFIC SEALING TECHNOLOGY / SST 3130
说明
500 DEG C, REBUILT VALVES AND VACUUM PUMP VACUUM BELOW 50 MILLITORR PRESSURES EXCEEDING 50 PSI
配置
无配置
OEM 型号描述
The Model 3130 is a vacuum and pressure furnace that provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. Process profiles are easily created, and the process data can be analyzed off-line. The system is used in both production and research environments for flux-free soldering, brazing, annealing and glass sealing of components and packages for microelectronic applications.
文件

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PREFERRED
 
SELLER
类别
Furnaces / Diffusion

上次验证: 30 多天前

Buyer pays 12% premium of final sale price
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

124174


晶圆尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
 
SELLER

SCIENTIFIC SEALING TECHNOLOGY / SST

3130

verified-listing-icon
已验证
类别
Furnaces / Diffusion
上次验证: 30 多天前
listing-photo-25ba13e00d9c41fb8e3da34fff179d32-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Buyer pays 12% premium of final sale price
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

124174


晶圆尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
500 DEG C, REBUILT VALVES AND VACUUM PUMP VACUUM BELOW 50 MILLITORR PRESSURES EXCEEDING 50 PSI
配置
无配置
OEM 型号描述
The Model 3130 is a vacuum and pressure furnace that provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. Process profiles are easily created, and the process data can be analyzed off-line. The system is used in both production and research environments for flux-free soldering, brazing, annealing and glass sealing of components and packages for microelectronic applications.
文件

无文件