说明
MLD Nitride Furnace配置
MLD Nitride FurnaceOEM 型号描述
TELINDY PLUS™ IRad™ is the definitive intersection between thermal large-batch and plasma processing. TELINDY PLUS™ IRad™ maintains all of the design advantages of the field proven, high productivity and reliable TELINDY PLUS™ platform while incorporating a damage-free plasma capability. Thus, the TELINDY PLUS™ IRad™ further extends the process domain of batch technology to new, lower temperature regimes while maintaining deposited film quality. TELINDY PLUS™ IRad™ provides a stable platform for high quality thin film deposition at low temperature which is increasingly desired for advanced device scaling and dense 3D structures. Predominant applications include ultra-low temperature ALD Si3N4 and SiO2. With the included dry gas cleaning capability, both down time reduction and superior particle performance are realized.文件
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TEL / TOKYO ELECTRON
TELINDY PLUS IRad
已验证
类别
Furnaces / Diffusion
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
56306
晶圆尺寸：
12"/300mm
年份：
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
TELINDY PLUS IRad
类别
Furnaces / Diffusion
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
56306
晶圆尺寸：
12"/300mm
年份：
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
MLD Nitride Furnace配置
MLD Nitride FurnaceOEM 型号描述
TELINDY PLUS™ IRad™ is the definitive intersection between thermal large-batch and plasma processing. TELINDY PLUS™ IRad™ maintains all of the design advantages of the field proven, high productivity and reliable TELINDY PLUS™ platform while incorporating a damage-free plasma capability. Thus, the TELINDY PLUS™ IRad™ further extends the process domain of batch technology to new, lower temperature regimes while maintaining deposited film quality. TELINDY PLUS™ IRad™ provides a stable platform for high quality thin film deposition at low temperature which is increasingly desired for advanced device scaling and dense 3D structures. Predominant applications include ultra-low temperature ALD Si3N4 and SiO2. With the included dry gas cleaning capability, both down time reduction and superior particle performance are realized.文件
无文件