Thermo Fisher Scientific Inc. (NYSE: TMO), the world leader in serving science, today announced that it has completed its acquisition of FEI Company, Inc. (NASDAQ: FEIC), the leader in high-performance electron microscopy. FEI and Philips joined their technologies in 1993 to create the first DualBeam (FIB/SEM) workstation.

THERMOFISHER SCIENTIFIC / FEI / PHILLIPS

DUALBEAM 830

The Thermo Scientific™ Helios 5 FX™ DualBeam continues the Helios legacy to the fifth generation combining the innovative Elstar™ with UC+ technology electron column for high-resolution and high materials contrast imaging, in-lens S/TEM 4 for 3Å in-situ low kV S/TEM imaging and the superior low kV performing Phoenix™ ion column for fast, precise and sub-nm damage sample preparation. In addition to the industry leading SEM and FIB columns, the Helios 5 FX incorporates a suite of state-of-the-art technologies which enable simple and consistent sample preparation (for high resolution S/TEM imaging and/or Atom Probe microscopy) on even the most challenging samples.

HELIOS 5 FX

FIB 611

DB-237

The Helios NanoLab 1200HP is a DualBeam system that can prepare ultra-thin samples with minimal damage in a short amount of time. It is equipped with iFast™ automation software, which makes it easy to use and ensures consistent results among multiple operators and systems. The system also features QuickFlip grid holders for improved sample quality and high throughput, as well as Cell Navigation software for automated navigation within non-unique memory arrays. These features enable the Helios NanoLab 1200HP to prepare high-quality, ultra-thin lamella in a consistent manner, regardless of operator skill level.

HELIOS NANOLAB 1200HP

 FEI Scios™ is an ultra-high-resolution analytical DualBeam™ system that delivers outstanding 2D and 3D performance for a broad range of samples, including magnetic material. With innovative features designed to increase throughput, precision, and ease of use, the FEI Scios is ideal for advanced research and analysis across academic, government, and industrial research environments.

SCIOS

EX-SITU PLUCKER

The Thermo Scientific™ Helios™ G4 HX DualBeam™ microscope is a high-throughput platform for preparing transmission electron microscope (TEM) lamellas. It uses a patented inverted TEM sample preparation method to create high-quality lamellas for advanced semiconductor nodes. The Helios G4 HX DualBeam integrates the EasyLift EX Nanomanipulator, Automated QuickFlip shuttle, and iFast automation software platform to provide a fully integrated, automated solution for Failure Analysis labs. The microscope also features low-loss in-lens detectors for improved materials contrast and extreme high-resolution SEM imaging at low-kV for accurate endpointing, resulting in increased yield during final thinning of the TEM sample.

HELIOS G4 HX

DUALBEAM 620

TEMLINK 150

The Helios NanoLab 650 features FEI’s advances in field emission SEM (FESEM) and focused ion beam (FIB) technologies and their combined use. As FEI’s 11th DualBeamTM platform, it is designed to access a new world of extreme high resolution (XHR) 2D and 3D characterization, nanoprototyping, and higher quality sample preparation.

HELIOS NANOLAB 650

HELIOS 5 CX

The Thermo Scientific Talos F200S (S)TEM is a (scanning) transmission electron microscope that combines outstanding high-resolution STEM and TEM imaging with industry-leading energy dispersive X-ray spectroscopy (EDS). The Talos F200S (S)TEM features great versatility and high through in STEM imaging and allows for precise EDS analysis and high-resolution TEM (HRTEM) for dynamic microscopy.

TALOS F200S G2

S/TEM (scanning / transmission electron microscope)
High-throughput, multi-purpose TEM with low-distortion imaging

TALOS F200E

The Thermo Scientific™ Helios™ 5 UC DualBeam is part of the fifth generation of the industry-leading Helios DualBeam family. It is carefully designed to meet the needs of scientists and engineers, combining the innovative Thermo Scientific™ Elstar™ Electron Column with high-current UC+ technology for extreme high-resolution imaging and the highest materials contrast with the superior Thermo Scientific™ Tomahawk™ HT Focused Ion Beam (FIB) Column for the fastest, easiest and most precise high-quality sample preparation. In addition to the most advanced electron and ion optics, the Helios 5 UC DualBeam incorporates a suite of state-of-the-art technologies that enables simple and consistent high-resolution S/TEM and atom probe tomography (APT) sample preparation, as well as the highest quality subsurface and 3D characterization, even on the most challenging samples.

HELIOS 5 UC

The Talos F200X G2 scanning transmission electron microscope ((S)TEM) delivers the most precise, quantitative characterization of nanomaterials in multiple dimensions. With innovative features designed to increase throughput, precision, and ease of use, the Talos F200X G2 (S)TEM is ideal for advanced research and analysis across academic, government, and industrial research environments.

TALOS F200X G2

The Helios NanoLab G3 family is designed to explore the nanoscale dimension beyond any limit set by its predecessors, and adjust even more closely to the needs of scientists and engineers. New standards are set for characterizing samples with extreme high resolution (XHR), preparing samples with highest quality standards and rapidly fabricating functional prototypes, quickly and easily.

HELIOS NANOLAB G3 CX

The Helios NanoLab™ 460F1 includes the EasyLift Nanomanipulator, which supports improved transmission electron microscopy (TEM) sample extraction yields through an intuitive, integrated UI. It also uses the MultiChem gas delivery system to optimize beam-assisted deposition or etching. Both systems are designed and built based on years of application knowledge and expertise in in situ sample extraction and gas-assisted FIB/SEM. In addition to simplifying the process of advanced failure analysis and TEM sample preparation, EasyLift and MultiChem improve operator confidence and consistency, thereby reducing the cost of ownership associated with the use of consumables. With the Helios 460F1 system, Discovery Labs can produce high-contrast, high-resolution STEM images, reducing "time to useful data" and reducing the need for a standalone S/TEM system. Every hour or day spent waiting for a laboratory to generate new process or material qualification data can cause delays in bringing a new product to market. With the ability to quickly generate high-quality, actionable 30 kV STEM images within the DualBeam, there are clear advantages for your laboratory.

HELIOS NANOLAB 460F1

Helios G4 UX is part of the fourth generation of the industry-leading Helios DualBeam™ family. It is carefully designed to meet the needs of scientists and engineers, combining the innovative Elstar electron column with high-current UC+ technology for extreme high-resolution imaging and the highest materials contrast with the superior Phoenix ion column for the fastest, easiest, and most precise high-quality sample preparation and 3D characterization, even on the most challenging samples.

HELIOS G4 UX

The 450HP and 1200HP DualBeam systems include new capability that meets the critical requirements for semiconductor process development at the 28nm device geometry node and below. The 450HP model can accommodate samples up to 100mm wafers.

HELIOS NANOLAB 450HP

Combining the most recent advances in focused ion and electron beams and expanding their combined use with the third generation of the Helios NanoLab.
The Helios NanoLab G3 family is designed to explore the nanoscale dimension beyond any limit set by its predecessors, and adjust even more closely to the needs of scientists and engineers. New standards are set for characterizing samples with extreme high resolution (XHR), preparing samples with highest quality standards and rapidly fabricating functional prototypes, quickly and easily.

HELIOS NANOLAB G3 UC

The Helios NanoLab 460HP is a high-performance imaging and analysis platform that can accurately locate defects in repetitive structures using FEI’s Cell Navigator-based automatic sample navigation. This can improve the success rate of finding the target region of interest by more than 5%. The platform also features a patented reverse TEM sample preparation method based on FEI’s EasyLift EX Nanomanipulator, QuickFlip shuttle, and iFast automated software platform, providing the highest throughput in the industry. With higher material contrast based on the new low-loss penetrating detector and ultra-high-resolution SEM imaging at low voltages, the Helios NanoLab 460HP ensures accurate endpoint detection, improving yield during final thinning of TEM samples. The combination of these unique features can ultimately increase TEM lamella sample throughput by more than 30% compared to the Helios NanoLab 450. 

HELIOS NANOLAB 460HP

The Thermo Scientific Helios NanoLab 1200AT DualBeam can create site-specific transmission electron microscope (TEM) samples thin enough to capture a single transistor at the 10nm node, from wafers up to 300mm in diameter. An optional Automated FOUP Loader (AFL) allows the system to be located inside the semiconductor wafer fab, where it can deliver critical information up to three times faster than laboratory-based analysis.

HELIOS NANOLAB 1200AT 

The Thermo Scientific™ Helios™ G4 CX DualBeam™ System is part of the fourth generation of the industry-leading Helios DualBeam family. It is carefully designed to meet the needs of scientists and engineers, combining the innovative Thermo Scientific Elstar™ electron column for ultra-high-resolution imaging and highest materials contrast with the superior Thermo Scientific Tomahawk™ Focused Ion Beam (FIB) column for the fastest, easiest, and most precise high-quality sample preparation. In addition to the most advanced electron and ion optics, the Helios G4 CX DualBeam System incorporates a suite of state-of-the-art technologies that enable simple and consistent high-resolution S/TEM and Atom Probe Tomography (APT) sample preparation, as well as the highest quality subsurface and 3D characterization, even on the most challenging samples.

HELIOS G4 CX

OptiFIB TAIPAN

The Expida 1255S, the first full wafer DualBeam to Include scanning transmission electron microscope (STEM) imaging capability, provides a complete solution for high resolution, high contrast STEM imaging, analysis, and sample preparation. As device sizes have continued to shrink, they have passed beyond the resolving power of scanning electron microscopy (SEM) and into the sub nanometer realm of STEM. However, the thin samples required by STEM impeded its acceptance in manufacturing applications until recent developments in focused ion beam (FIB) based techniques made sample preparation fast and reliable. Now the 1255S adds STEM Imaging to a 300 mm full wafer DualBeam to provide a complete solution, from wafer to results, In a single system, slashing time-to-answer for critical process information from days or weeks to hours.

EXPIDA 1255S

The Thermo Scientifc™ Helios™ G4 UC DualBeam™ System is part of the fourth generation of the industry-leading Helios DualBeam family. It is carefully designed to meet the needs of scientists and engineers, combining the innovative Thermo Scientific Elstar™ electron column with high-current UC+ technology for extreme high-resolution imaging and the highest materials contrast with the superior Thermo Scientific Tomahawk™ Focused Ion Beam (FIB) ion column for the fastest, easiest, and most precise high-quality sample preparation. In addition to the most advanced electron and ion optics, the Helios G4 UC DualBeam System incorporates a suite of state-ofthe-art technologies that enable simple and consistent highresolution S/TEM and Atom Probe Tomography (APT) sample preparation, as well as the highest-quality subsurface and 3D characterization, even on the most challenging samples.

HELIOS G4 UC

TEMLINK - KY02, 14771-003

Develop 7 nm devices with shorter data generation time.

HELIOS G4 FX

The Thermo Scientific™ Helios™ G4 PFIB HXe DualBeam System provides unique capabilities to enable damage-free delayering of 10nm semiconductor devices and advanced failure analysis of 3D packages, in addition to a wide range of other large area FIB processing applications.

HELIOS G4 PFIB HXe

The FEI Helios NanoLab 450 is a DualBeam™ system designed for imaging, analysis, and TEM sample preparation in semiconductor failure analysis labs. It is intended for advanced semiconductor labs that face various challenges, such as decreasing dimensions at sub 32-nm nodes, advanced packaging methods, and an increased number of samples that require TEM imaging. The Helios NanoLab series combines the Elstar electron column with UC technology for high-resolution and high-contrast imaging and the TomahawkTM ion column for quick and accurate sample cross-sectioning. The Helios NanoLab 450S is well-suited for high throughput and high-resolution S/TEM sample preparation, imaging, and analysis. Its unique FlipStage and in-situ STEM detector can switch from sample preparation to STEM imaging in seconds without breaking the vacuum or exposing the sample to the environment.

HELIOS NANOLAB 450

The Thermo Scientific™ Helios™ 5 HX DualBeam continues the Helios DualBeam legacy to the fifth generation by combining the innovative Thermo Scientific™ Elstar™ Electron Column with UC+ technology for high-resolution and high materials contrast imaging and the superior low-kV performance of the Thermo Scientific™ Phoenix™ Ion Column for fast, precise and sub-nm damage sample preparation. In addition to the industry leading SEM and FIB columns, the Helios 5 HX DualBeam incorporates a suite of state-of-the-art technologies that enable simple and consistent sample preparation for high-resolution TEM imaging on even the most challenging samples.

HELIOS 5 HX

The Thermo Scientific Scios 2 DualBeam is an ultra-high-resolution analytical focused ion beam scanning electron microscopy (FIB-SEM) system that provides outstanding sample preparation and 3D characterization performance for a wide range of samples, including magnetic and non-conductive materials. With innovative features designed to increase throughput, precision, and ease of use, the Scios 2 DualBeam is an ideal solution to meet the needs of scientists and engineers in advanced research and analysis across academic, governmental, and industrial research environments.

SCIOS 2

The Thermo Scientific Talos F200i (S)TEM is a 20-200 kV field emission (scanning) transmission electron microscope uniquely designed for performance and productivity across a wide range of Materials Science samples and applications. Its standard X-Twin pole piece gap—giving the highest flexibility in applications—combined with a reproducibly performing electron column opens opportunities for high-resolution 2D and 3D characterization, in situ dynamic observations, and diffraction applications.

TALOS F200i

The Thermo Scientific™ Helios™ 5 UX DualBeam is part of the fifth generation of the industry-leading Helios DualBeam family. It is carefully designed to meet the needs of scientists and engineers, combining the innovative Thermo Scientific™ Elstar™ Electron Column with high-current UC+ technology for extreme high resolution imaging and the highest materials contrast with the superior Thermo Scientific™ Phoenix™ Focused Ion Beam (FIB) Column for the fastest, easiest and most precise high-quality sample preparation. In addition to the most advanced electron and ion optics, the Helios 5 UX DualBeam incorporates a suite of state-of-the-art technologies that enables simple and consistent high-resolution S/TEM and atom probe tomography (APT) sample preparation, as well as the highest-quality subsurface and 3D characterization, even on the most challenging samples.

HELIOS 5 UX 

Thermo Scientific™ Helios™ G4 PFIB delivers unmatched capabilities for large volume 3D characterization, Ga+free sample preparation and precise micromachining. Helios G4 PFIB UXe is part of the fourth generation of the industry-leading Helios DualBeam family. It combines the new PFIB 2.0 column and the Thermo Scientific™ Monochromated Elstar™ SEM column to deliver the most advanced focused ion- and electron beam performance. Intuitive software and an unprecedented level of automation and ease-of-use provide observation and analysis of relevant subsurface volumes by scientists and engineers.

HELIOS G4 PFIB UXe

The DualBeam 865 is a FIB/SEM system with 3DCD automation designed to provide thin film head manufacturers with fast, precise, automatic, three-dimensional CD (critical dimension) measurements. The system is capable of measuring multi-layer three-dimensional structures that are difficult or impossible to see with conventional, single-layer, top-down techniques. It automatically ion-mills a cross section, acquires a high-resolution SEM image of the exposed face, and measures cross-sectional CDs to provide fast, precise control of the head manufacturing process. The DualBeam 865 integrates high-performance subsystems such as the Magnum ion column and the dual-mode Hexalens electron column for faster milling and high-resolution SEM imaging. Advanced 3DCD automation permits unattended operation for increased operator productivity and the system is fully compliant with the fab environment and multi-vendor yield management data systems.

DUALBEAM 865

VECTRA+

The FEI V400ACE is a state-of-the-art Focused Ion Beam (FIB) system that integrates the most recent advancements in ion column technology, gas delivery, and end point detection. This allows for quick, efficient, and cost-effective circuit editing on advanced integrated circuits. With circuit editing, product designers can alter conductive pathways and test the changes within hours, instead of waiting weeks or months to create new masks and process new wafers. The V400ACE is specifically engineered to tackle the challenges posed by modern designs and processes, such as smaller geometries, higher circuit densities, new materials, and intricate interconnect structures. 

V400ACE

The Helios NanoLab 660 is a state-of-the-art DualBeam system developed by FEI. It combines the power of both ion and electron beams to provide FIB (Focused Ion Beam) and SEM (Scanning Electron Microscopy) capabilities in a single machine. This system is designed to provide detailed, multi-dimensional insights at a sub-nanometer resolution. It incorporates the latest advances in field emission SEM (FESEM) and focused ion beam (FIB) technologies, allowing for their combined use. As the 11th DualBeam platform from FEI, the Helios NanoLab 660 opens up new possibilities for extreme high-resolution 2D and 3D characterization, nanoprototyping, and high-quality sample preparation.

HELIOS NANOLAB 660

HELIOS 5 HP

FIB 610

Helios G4 PFIB CXe DualBeam provides unique capabilities to enable advanced failure analysis of 3D packages, damage free delayering of semiconductor devices in addition to a wide range of other large area FIB processing applications.

HELIOS G4 PFIB CXe

Helios NanoLab 1200 Full Wafer DualBeam Technology for High Resolution Imaging, Analysis and TEM Sample Preparation for 300 mm Wafers

HELIOS NANOLAB 1200

The FEI FIB 800 is a state-of-the-art Focused Ion Beam (FIB) system that is utilized for a variety of applications, including circuit editing, defect and failure analysis, TEM lamella preparation, nanofabrication, nanoprototyping, and MEMS. It employs a Magnum ion column and boasts a milling power of 21nA beam current. The system can accommodate samples with diameters up to 200mm and features a 5-axis motorized eucentric tilt stage. Additionally, it includes a gas injection system with up to four injectors and a vacuum system with column IGP, air-cooled Turbo, and mechanical PVP. 

FIB 800

The Helios NanoLab 400 is a DualBeam system that integrates both ion and electron beams for Focused Ion Beam (FIB) and Scanning Electron Microscopy (SEM) functionality in one machine. This allows users to switch between the two beams for quick and accurate navigation and milling. The convergence of the SEM and FIB at a short working distance enables precision “slice-and-view” cross-sectioning and analysis at high resolution. This system provides a powerful tool for sample preparation and analysis.

HELIOS NANOLAB 400

The FEI V600CE is a focused ion beam (FIB) system designed for fast, efficient, and cost-effective circuit editing on advanced integrated circuits at the 65 nm technology node and beyond. It incorporates the latest developments in ion column design, gas delivery, and end point detection. Circuit editing allows product designers to reroute conductive pathways and test modified circuits in hours, rather than the weeks or months required to generate new masks and process new wafers. This results in fewer, shorter modification and test cycles, allowing manufacturers to ramp up new processes faster and be first to market with premium-priced new products. The V600CE is specifically designed to meet the challenges of advanced designs and processes, including smaller geometries, higher circuit densities, exotic materials, and complex interconnect structures. It can also be configured for backside editing with an optional IR microscope and bulk silicon trenching package.

V600CE

V600

HELIOS NANOLAB 450S

DUALBEAM 820

Expida 1255 wafer DualBeam system, FEI: Ultra-High-Resolution Analysis - Following the success of its Expida 1255 wafer DualBeam system for semiconductor labs, FEI Company has introduced the next-generation tool in the product family, the Expida 1255S. 

EXPIDA 1255

EXPIDA 1265

The Helios NanoLab 400S is a DualBeam system from FEI that integrates both ion and electron beams for FIB (Focused Ion Beam) and SEM (Scanning Electron Microscopy) functionality in one machine. This allows users to switch between the two beams for quick and accurate navigation and milling. The convergence of the SEM and FIB at short working distance enables precision “slice-and-view” cross-sectioning and analysis at high resolution.

6" Fab For Sale from Moov - Click Here to Learn More

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6" Fab For Sale from Moov - Click Here to Learn More

THERMOFISHER SCIENTIFIC / FEI / PHILLIPS

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HELIOS 5 CX

FIB 611

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TALOS F200S G2

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