说明
无说明配置
Recently offline and has been wrapped.OEM 型号描述
W-GM-4250 is a Wafer Edge Grinding Machine from the W-GM series by TOSEI ENGINEERING CORP. It has 2 grinding stages with a 4-cassette loader and is capable of grinding various materials such as Silicon, Sapphire and compound materials such as SiC. It is designed for easy operation by touch screen and graphical user interface. The W-GM-4250 is part of the W-GM-4200 Series and is designed for 2" to 8" wafer production.文件
无文件
ACCRETECH / TOSEI
W-GM-4250
已验证
类别
Lapping, Polishing, Grinding
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
63721
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TOSEI
W-GM-4250
类别
Lapping, Polishing, Grinding
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
63721
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Recently offline and has been wrapped.OEM 型号描述
W-GM-4250 is a Wafer Edge Grinding Machine from the W-GM series by TOSEI ENGINEERING CORP. It has 2 grinding stages with a 4-cassette loader and is capable of grinding various materials such as Silicon, Sapphire and compound materials such as SiC. It is designed for easy operation by touch screen and graphical user interface. The W-GM-4250 is part of the W-GM-4200 Series and is designed for 2" to 8" wafer production.文件
无文件