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说明
无说明配置
with Lintec RAD 2700 F/12 inlineOEM 型号描述
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.文件
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DISCO
DGP8761
类别
Lapping, Polishing, Grinding
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
121171
晶圆尺寸：
未知
年份：
2011
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说明
无说明配置
with Lintec RAD 2700 F/12 inlineOEM 型号描述
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.文件
无文件