说明
Wafer Backside Grinder配置
无配置OEM 型号描述
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.文件
无文件
DISCO
DGP8761
已验证
类别
Lapping, Polishing, Grinding
上次验证： 24 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116270
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
类似上架物品
查看全部
DISCO
DGP8761
类别
Lapping, Polishing, Grinding
上次验证： 24 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
116270
晶圆尺寸：
8"/200mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Wafer Backside Grinder配置
无配置OEM 型号描述
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.文件
无文件