
说明
Size: 2.4*1.75*2.65m Weight: 5.5t (not include the wooden box)配置
Include - optional correction wheel - upper and lower platesOEM 型号描述
Wafer Grinding, Lapping, Polishing文件
类别
Lapping, Polishing, Grinding
上次验证: 3 天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
136524
晶圆尺寸:
未知
年份:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SPEEDFAM
16B-5L-III
类别
Lapping, Polishing, Grinding
上次验证: 3 天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
136524
晶圆尺寸:
未知
年份:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available