说明
Dielectric Characterization Tool with COCOS & Epi-t for up to 300mm Wafers, Parts Only配置
无配置OEM 型号描述
The SEMILAB FAaST 330 is an electrical metrology system that uses non-contact methods to measure the properties of materials. It combines two patented techniques, known as Micro and Macro corona-Kelvin methods, into one platform. This system is designed to support both advanced research and development and high-volume manufacturing environments. The FAaST 330/230 DSPV systems provide fast, non-contact monitoring of heavy metal contamination in wafers, with the ability to detect even very low levels of contamination. The FAaST 330/230 C-V / I-V systems use advanced measurement techniques to provide non-contact imaging of dielectric and interface properties on monitor wafers. These systems include automated wafer handling and are suitable for medium to high-volume manufacturing environments.文件
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SEMILAB
FAAST 330
已验证
类别
Metrology
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
57796
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SEMILAB
FAAST 330
已验证
类别
Metrology
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
57796
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Dielectric Characterization Tool with COCOS & Epi-t for up to 300mm Wafers, Parts Only配置
无配置OEM 型号描述
The SEMILAB FAaST 330 is an electrical metrology system that uses non-contact methods to measure the properties of materials. It combines two patented techniques, known as Micro and Macro corona-Kelvin methods, into one platform. This system is designed to support both advanced research and development and high-volume manufacturing environments. The FAaST 330/230 DSPV systems provide fast, non-contact monitoring of heavy metal contamination in wafers, with the ability to detect even very low levels of contamination. The FAaST 330/230 C-V / I-V systems use advanced measurement techniques to provide non-contact imaging of dielectric and interface properties on monitor wafers. These systems include automated wafer handling and are suitable for medium to high-volume manufacturing environments.文件
无文件