SEMILAB

MCV-2200

SEMILAB PMR-3000 is an in-line monitoring unit for ion implantation monitoring use prior to the thermal annealing process step.

PMR-3000

The MCV automatic mapping systems provide a Mercury C-V measurement for non-patterned wafers used in epitaxial silicon production and front-end semiconductor processing.

MCV 2500

-Wafer handling: Robot up to 300 mm
-Inspected area: Full sheet wafers
-Probes: 4PP (FEOL & BEOL) , EDDY (BEOL) , JPV (FEOL)
-1-4 permanent 4PP heads for different ranges & applications, Lower CoO
-Implant dose range: 1012 to 5×1015 1/cm2
-Cleanroom class: class 1 minienvironment

RT-3000

IR-2200

The FAaST 300 SL system is a non-contact electrical metrology system that combines both Micro and Macro corona-Kelvin methods into a single platform. It is designed to support advanced R&D as well as high-volume manufacturing environments. The system features automatic robotic wafer handling, dual FOUP Loadport, and is suitable for patterned wafer and monitor wafer measurements. It uses Semilab SDI’s patented high-resolution Micro corona-Kelvin based on Kelvin Probe Force Microscopy (KPFM) for measurement of dielectric and interface properties. The system also includes an advanced 2-step Non-Visual Defect (NVD) Inspection that combines full wafer Macro surface voltage imaging and focused high-resolution intra-die surface voltage imaging using KPFM. The FAaST software package includes Measurement, Recipe Writing, and Data Viewing applications. The system is suitable for measurement on semiconductors with high-k and low-k dielectric films, and is available in a default configuration for 300mm wafers or with an option for 200mm/300mm bridge configuration. Additional options include a Mini-environment, 300mm Semi compliant Automation, Seismic brackets, wafer OCR, RFID, cassette barcode reader, and a 1000V Vcpd measurement range.

FAAST 300 SL

The SEMILAB FAaST 330 is an electrical metrology system that uses non-contact methods to measure the properties of materials. It combines two patented techniques, known as Micro and Macro corona-Kelvin methods, into one platform. This system is designed to support both advanced research and development and high-volume manufacturing environments. The FAaST 330/230 DSPV systems provide fast, non-contact monitoring of heavy metal contamination in wafers, with the ability to detect even very low levels of contamination. The FAaST 330/230 C-V / I-V systems use advanced measurement techniques to provide non-contact imaging of dielectric and interface properties on monitor wafers. These systems include automated wafer handling and are suitable for medium to high-volume manufacturing environments. 

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MCV-2200

MCV 2500

PMR-3000

IR-2200

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