Dielectric Characterization Tool with COCOS & Epi-t for up to 300mm Wafers, Parts Only

SEMILAB

The SEMILAB FAaST 330 is an electrical metrology system that uses non-contact methods to measure the properties of materials. It combines two patented techniques, known as Micro and Macro corona-Kelvin methods, into one platform. This system is designed to support both advanced research and development and high-volume manufacturing environments. The FAaST 330/230 DSPV systems provide fast, non-contact monitoring of heavy metal contamination in wafers, with the ability to detect even very low levels of contamination. The FAaST 330/230 C-V / I-V systems use advanced measurement techniques to provide non-contact imaging of dielectric and interface properties on monitor wafers. These systems include automated wafer handling and are suitable for medium to high-volume manufacturing environments.

SEMILAB

FAAST 330

Metrology

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FAAST 330

Metrology

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