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ASMPT LASER1205
  • ASMPT LASER1205
  • ASMPT LASER1205
  • ASMPT LASER1205
说明
Laser Saw
配置
无配置
OEM 型号描述
The Laser1205 platform is a family of systems specially developed for the separation and/or grooving of semiconductor wafers by means of laser energy. The family contains fully automated systems designed for sustained high quality production in an industrial environment.
文件

无文件

类别
Laser

上次验证: 60 多天前

物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

113836


晶圆尺寸:

6"/150mm


年份:

未知


Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

ASMPT

LASER1205

verified-listing-icon
已验证
类别
Laser
上次验证: 60 多天前
listing-photo-4aa1ff491e5b46189d6d8081bf06c185-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

113836


晶圆尺寸:

6"/150mm


年份:

未知


Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Laser Saw
配置
无配置
OEM 型号描述
The Laser1205 platform is a family of systems specially developed for the separation and/or grooving of semiconductor wafers by means of laser energy. The family contains fully automated systems designed for sustained high quality production in an industrial environment.
文件

无文件