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说明
Dies on wafer separation配置
LASER1205UV Details in photo below.OEM 型号描述
The Laser1205 platform is a family of systems specially developed for the separation and/or grooving of semiconductor wafers by means of laser energy. The family contains fully automated systems designed for sustained high quality production in an industrial environment.文件
ASMPT
LASER1205
类别
Laser
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
82098
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available