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ASMPT LASER1205
    说明
    Dies on wafer separation
    配置
    LASER1205UV Details in photo below.
    OEM 型号描述
    The Laser1205 platform is a family of systems specially developed for the separation and/or grooving of semiconductor wafers by means of laser energy. The family contains fully automated systems designed for sustained high quality production in an industrial environment.
    文件
    类别
    Laser

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    82098


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    ASMPT

    LASER1205

    verified-listing-icon
    已验证
    类别
    Laser
    上次验证: 60 多天前
    listing-photo-67ffe09cb7114c628e3feb59881f0ba0-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/74509/67ffe09cb7114c628e3feb59881f0ba0/abde573bc4c44f2b937e5efd9e3bd4de_screenshot20231211at12_mw.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    82098


    晶圆尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    Dies on wafer separation
    配置
    LASER1205UV Details in photo below.
    OEM 型号描述
    The Laser1205 platform is a family of systems specially developed for the separation and/or grooving of semiconductor wafers by means of laser energy. The family contains fully automated systems designed for sustained high quality production in an industrial environment.
    文件