
说明
Dies on wafer separation配置
LASER1205UV Details in photo below.OEM 型号描述
The Laser1205 platform is a family of systems specially developed for the separation and/or grooving of semiconductor wafers by means of laser energy. The family contains fully automated systems designed for sustained high quality production in an industrial environment.文件
ASMPT
LASER1205
类别
Laser
上次验证: 60 多天前
物品主要详细信息
状况:
Used
运行状况:
未知
产品编号:
82098
晶圆尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available