说明
Laser Saw配置
无配置OEM 型号描述
The Laser1205 platform is a family of systems specially developed for the separation and/or grooving of semiconductor wafers by means of laser energy. The family contains fully automated systems designed for sustained high quality production in an industrial environment.文件
无文件
ASMPT
LASER1205
已验证
类别
Laser
上次验证： 19 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
113834
晶圆尺寸：
6"/150mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASMPT
LASER1205
类别
Laser
上次验证： 19 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
113834
晶圆尺寸：
6"/150mm
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Laser Saw配置
无配置OEM 型号描述
The Laser1205 platform is a family of systems specially developed for the separation and/or grooving of semiconductor wafers by means of laser energy. The family contains fully automated systems designed for sustained high quality production in an industrial environment.文件
无文件