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说明
无说明配置
Minimum Spot Size (1/e2): 2.0μm Accuracy: .20μm Wavelength: 1.3μm – LightWave Laser rep rate: 30kHz Maximum cut velocity: 200mm/second Wafer Diameter 200mm / 300mm.(S‐type for 150mm)OEM 型号描述
The Model 9820 is based on ESI’s highly successful 98XX platform, which was developed specifically for advanced DRAM, SRAM, embedded memory and other laser fuse applications. The 9820 offers a wide process window, and small spot sizes to address the requirements of most high-speed chips. The large-field 98XX platform minimizes alignment, stepping and other overhead factors that impact throughput, while auto-adjusting optics keep optical components perfectly aligned for optimal process performance and highest productivity. Capable of processing new generations of tight pitch fuses Designed for high volume, automated 300 mm production Wide range of processing applications – Poly Si, Al, and Cu capable New high-performance laser option文件
无文件
ESI
9820
类别
Laser
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
Deinstalled
产品编号：
105420
晶圆尺寸：
6"/150mm, 8"/200mm, 12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Minimum Spot Size (1/e2): 2.0μm Accuracy: .20μm Wavelength: 1.3μm – LightWave Laser rep rate: 30kHz Maximum cut velocity: 200mm/second Wafer Diameter 200mm / 300mm.(S‐type for 150mm)OEM 型号描述
The Model 9820 is based on ESI’s highly successful 98XX platform, which was developed specifically for advanced DRAM, SRAM, embedded memory and other laser fuse applications. The 9820 offers a wide process window, and small spot sizes to address the requirements of most high-speed chips. The large-field 98XX platform minimizes alignment, stepping and other overhead factors that impact throughput, while auto-adjusting optics keep optical components perfectly aligned for optimal process performance and highest productivity. Capable of processing new generations of tight pitch fuses Designed for high volume, automated 300 mm production Wide range of processing applications – Poly Si, Al, and Cu capable New high-performance laser option文件
无文件