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VEECO / ULTRATECH AP300
    说明
    C4 EXPOSE, WIDEFIELD
    配置
    无配置
    OEM 型号描述
    The ULTRATECH AP300 is a stepper and scanner system that can produce wafers of 200-300mm in size. It is built on Veeco’s customizable Unity Platform™, which delivers superior overlay, resolution, and side wall profile performance, enabling highly automated and cost-effective manufacturing. The AP300 is particularly well-suited for copper pillar, fan-out, through-silicon via (TSV), and silicon interposer applications. It also has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment, and optical focus.
    文件

    无文件

    VEECO / ULTRATECH

    AP300

    verified-listing-icon

    已验证

    类别
    Lithography

    上次验证: 60 多天前

    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    73807


    晶圆尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    类似上架物品
    查看全部
    VEECO / ULTRATECH AP300

    VEECO / ULTRATECH

    AP300

    Lithography
    年份: 2006状况: 二手
    上次验证2 天前

    VEECO / ULTRATECH

    AP300

    verified-listing-icon
    已验证
    类别
    Lithography
    上次验证: 60 多天前
    listing-photo-b6ea188f4e9f499b8e1cec095b8bc30d-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    物品主要详细信息

    状况:

    Used


    运行状况:

    未知


    产品编号:

    73807


    晶圆尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    说明
    C4 EXPOSE, WIDEFIELD
    配置
    无配置
    OEM 型号描述
    The ULTRATECH AP300 is a stepper and scanner system that can produce wafers of 200-300mm in size. It is built on Veeco’s customizable Unity Platform™, which delivers superior overlay, resolution, and side wall profile performance, enabling highly automated and cost-effective manufacturing. The AP300 is particularly well-suited for copper pillar, fan-out, through-silicon via (TSV), and silicon interposer applications. It also has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment, and optical focus.
    文件

    无文件

    类似上架物品
    查看全部
    VEECO / ULTRATECH AP300

    VEECO / ULTRATECH

    AP300

    Lithography年份: 2006状况: 二手上次验证:2 天前
    VEECO / ULTRATECH AP300

    VEECO / ULTRATECH

    AP300

    Lithography年份: 0状况: 二手上次验证:60 多天前