说明
EVG620 Mask Aligner, dual-use tool designed for optical double-side lithography and precision alignment capable up to 150 mm wafer sizes, Automatic Alignment, Topside Alignment (TSA), Bottomside Alignment (BSA), Automatic Alignment, Genmark Gencobot 4S Robot & System Controller, Pre-aligner, Cassette to Cassette Handling, Motorized Alignment Stage (X,Y,Theta) w/ 3-Axis Joystick, Microsoft based User Interface, 10x Objectives (Qty 4). Spare Parts: Yes Manuals: No Decon/De-install: January - 2019配置
-Power Supply o Voltage: 208V o Frequency: 50/60Hz o Phase: single o Power Consumption: 1.8kW -Air Supply o CDA: 6 bar / 87 psi -Nitrogen Source o Nitrogen: 6 bar / 87 psi -Vacuum o <850 mbar / 646 TorrOEM 型号描述
The EVG620 is a versatile tool developed by EV Group (EVG) that serves as both an optical double-side lithography and precision alignment system, specifically designed for wafers up to 100 mm in size. The system is capable of safely handling thick, bowed, or small diameter wafers, providing enhanced flexibility in wafer processing. The EVG620's alignment stage design is a standout feature, delivering highly accurate alignment and exposure results for precise patterning. It is equipped with high-resolution top and bottom side split-field microscopes, ensuring excellent imaging capabilities. The user-friendly interface, based on Windows, streamlines the operation of the EVG620, making it a reliable and efficient tool for various lithography and alignment applications in semiconductor and microelectronics manufacturing.文件
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类别
Mask/Bond Aligners
上次验证： 18 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
149382
晶圆尺寸：
未知
年份：
2008
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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EVGroup (EVG)
EVG620
类别
Mask/Bond Aligners
上次验证： 18 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
149382
晶圆尺寸：
未知
年份：
2008
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
EVG620 Mask Aligner, dual-use tool designed for optical double-side lithography and precision alignment capable up to 150 mm wafer sizes, Automatic Alignment, Topside Alignment (TSA), Bottomside Alignment (BSA), Automatic Alignment, Genmark Gencobot 4S Robot & System Controller, Pre-aligner, Cassette to Cassette Handling, Motorized Alignment Stage (X,Y,Theta) w/ 3-Axis Joystick, Microsoft based User Interface, 10x Objectives (Qty 4). Spare Parts: Yes Manuals: No Decon/De-install: January - 2019配置
-Power Supply o Voltage: 208V o Frequency: 50/60Hz o Phase: single o Power Consumption: 1.8kW -Air Supply o CDA: 6 bar / 87 psi -Nitrogen Source o Nitrogen: 6 bar / 87 psi -Vacuum o <850 mbar / 646 TorrOEM 型号描述
The EVG620 is a versatile tool developed by EV Group (EVG) that serves as both an optical double-side lithography and precision alignment system, specifically designed for wafers up to 100 mm in size. The system is capable of safely handling thick, bowed, or small diameter wafers, providing enhanced flexibility in wafer processing. The EVG620's alignment stage design is a standout feature, delivering highly accurate alignment and exposure results for precise patterning. It is equipped with high-resolution top and bottom side split-field microscopes, ensuring excellent imaging capabilities. The user-friendly interface, based on Windows, streamlines the operation of the EVG620, making it a reliable and efficient tool for various lithography and alignment applications in semiconductor and microelectronics manufacturing.文件
无文件