说明

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配置

Detailed Configuration:- 1 x Basic Unit - PC controlled Microsoft Windows® based operating environment - Self diagnostics during machine start up, automatic initialization of all motors, position end switches, sensors and pneumatics. - Solid state drive and hard drive for high availability and reliability - LAN connection for remote connection and diagnostics - Data backup to USB and/or DVD - EC Declaration of Conformity - User interface including keyboard and monitor - Granite base frame construction for improved alignment accuracy 1 x User Interface - Graphical User Interface (GUI) for system operation - User interface including keyboard and monitor - Effective operation and control of the machine - Feedback from the machine - System integrated - Keyboard - 24" Monitor - Facility Connections Through Machine Sidewall - Does not require a cleanroom with raised floor / sub floor Software: - Microsoft Windows® based process software for recipes, processing and diagnostics - Automated recording of process parameters - Storage of files and presets on hard disk or network - Password protected access levels for operator, engineer and maintenance Process Modules Included: 1 x Optical Alignment Module - Wafer thickness 0.1 - 4.4 mm with a total stack of thickness of 4.5 mm (extended thickness range optional) - Loading with mechanical prealignment - Quick change of chuck with automatic pressure and vacuum transfer - Recipe parameters and user guidance for processes - Granite base frame construction for improved alignment accuracy 1 x Alignment Stage Fully Motorized - Fully motorized X, Y, Theta and Z alignment stage, alignment via three (3) axis joystick - With DC motor controllers for cursor key fine alignment - Automatic wedge compensation system designed for optimized print gap control - Adjustable WEC and exposure contact force 1 x NanoAlign Technology Package - Increases EVG aligner microscope resolution by factor ~2 (for improvement of alignment results or extended depth of focus) - Improved image quality due to 100 % digital signal processing - Enhanced digital zoom capabilities 1 x Bottom Side Microscope - Motorized splitfield microscopes for alignment in visible light with high resolution CCD-cameras - Bottom side alignment via digitized alignment keys (mask) or cross hair - Digital zoom software providing 2x and 4x image magnification for fine alignment with objectives - Travel range*: X: 78 (58) mm - 150 mm; Y: ± 12 mm *Actual travel range might be restricted by chuck design 1 x Recipe Controlled Microscope Illumination Spectrum - Contrast improving illumination system - Increased pattern visiblity due to spectral adjustment of microscope illumination light source - Improved alignment reliability for manual and automatic alignment processes - User definable illumination spectrum composed by two (2) individual adjustable LED light sources per microscope (red, green) 2 x Objective 5x 1 x Automatic Alignment for Top and/or Bottom Side / Cognex VisionPro® - Vector based image recognition - EVG proprietary software implementation based on Cognex VisionPro® - Storage of trained mask and substrate patterns on hard disk - Comply with user definable alignment marks for top and bottom side alignment - Key identification feature (detail search) for multi layer alignment key design - For scaled (over / under etched) alignment keys - Easy operation with menu assisted training of mask and wafer alignment marks 1 X Software for Bond Alignment - Recipe parameters and user guidance for bond alignment processes - Optical alignment of two (2) wafers (after manual loading) for Silicon Direct Bonding (SDB) or other substrate configurations like Si+Glass, Si+Si - For subsequent anodic, thermo-compression or fusion bonding processes in a EVG500 series bond system 1 X Loading Chuck for 120 mm Substrates (Double Stack) - Customized design - Special Loading Chuck for 120 mm substrates - Designed to support loading glass (glass not included) - For loading and alignment of top wafer - For double stack alignment - Recess for spring loaded clamping feet 1 X Rack Unit for EVG620 Bond Aligner - Integrates alignment module, operating elements and monitor - Vibration isolated - Prepared for robotic autoload system (Motorized Alignment Stage needed)

OEM 型号描述

The EVG®620 NT provides state-of-the art mask alignment technology on a minimized footprint area up to 150 mm wafer size. Known for its versatility and reliability, the EVG620 NT provides state-of-the-art mask alignment technology on a minimized footprint area combined with advanced alignment features and optimized total cost of ownership. It is an ideal tool for optical double-side lithography available in semi-automated or automated configuration with optional full-housing Gen 2 solution to meet high-volume production requirements and fab standards. Operator-friendly software, minimized time for mask and tooling changes, as well as efficient worldwide service and support makes it the ideal solution for any manufacturing environment. The EVG620 NT or the fully housed EVG620 NT Gen2 mask alignment systems are equipped with integrated vibration isolation, and achieve excellent exposure results for a wide range of applications, such as exposure of thin and thick resists, patterning of deep cavities and comparable topographies, as well as processing of thin and fragile materials such as compound semiconductors. Furthermore, the EVG’s proprietary SmartNIL technology is supported on both semi-automated and fully automated system configurations.