说明
Exposure Aligner Off Status: COLD Deminsion (cm): 180x180x230 Weight kg: 1,200.00 2F Rigging (Yes or No): No Missing parts: joystick & cic controller & mapping sensor abnormal, robot配置
无配置OEM 型号描述
The MA300Plus is a highly automated mask aligner for 300mm and 200mm wafers. It is specifically designed for wafer bumping and wafer level packaging applications but can be used as well for other technologies where geometries in the range of 3 and 100 microns have to be exposed.文件
无文件
类别
Mask/Bond Aligners
上次验证： 14 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
136201
晶圆尺寸：
8"/200mm
年份：
2007
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SUSS MicroTec / KARL SUSS
MA300 Plus
类别
Mask/Bond Aligners
上次验证： 14 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
136201
晶圆尺寸：
8"/200mm
年份：
2007
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Exposure Aligner Off Status: COLD Deminsion (cm): 180x180x230 Weight kg: 1,200.00 2F Rigging (Yes or No): No Missing parts: joystick & cic controller & mapping sensor abnormal, robot配置
无配置OEM 型号描述
The MA300Plus is a highly automated mask aligner for 300mm and 200mm wafers. It is specifically designed for wafer bumping and wafer level packaging applications but can be used as well for other technologies where geometries in the range of 3 and 100 microns have to be exposed.文件
无文件