说明
无说明配置
-Precision High Performance Mask Alignment and Exposure System -Version: 75 MM -System capable of exposing partial wafers or substrates up to a maximum size of 3 in. dia. Hard or soft contact modes. -High precision alignment stage X,Y, Theta. -Microscope consists of normal field microscope with objective turret for different magnafications. 365 to 400nm spectral range up to 350W. 110V, 60 Hz.OEM 型号描述
"The MJB 3 is perfect or photolithography R&D. The product line offers flexibility in handling irregularly shaped substrates and pieces of different thickness, as well as standard size wafers up to 3"". Various configurations are available see individual listings for more details on light sources and alignment modes. The MBJ 3 offers three exposure modes: HP (high precision), ST (standard), SOFT CONT (soft contact). Capabilities: exposure of thin and thick resist materials, ultimate resolution ~ 1μm, substrates up to 75mm in diameter, masks up to 100 mm x 100 mm in size."文件
无文件
SUSS MicroTec / KARL SUSS
MJB3
已验证
类别
Mask/Bond Aligners
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
62965
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SUSS MicroTec / KARL SUSS
MJB3
类别
Mask/Bond Aligners
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
62965
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
-Precision High Performance Mask Alignment and Exposure System -Version: 75 MM -System capable of exposing partial wafers or substrates up to a maximum size of 3 in. dia. Hard or soft contact modes. -High precision alignment stage X,Y, Theta. -Microscope consists of normal field microscope with objective turret for different magnafications. 365 to 400nm spectral range up to 350W. 110V, 60 Hz.OEM 型号描述
"The MJB 3 is perfect or photolithography R&D. The product line offers flexibility in handling irregularly shaped substrates and pieces of different thickness, as well as standard size wafers up to 3"". Various configurations are available see individual listings for more details on light sources and alignment modes. The MBJ 3 offers three exposure modes: HP (high precision), ST (standard), SOFT CONT (soft contact). Capabilities: exposure of thin and thick resist materials, ultimate resolution ~ 1μm, substrates up to 75mm in diameter, masks up to 100 mm x 100 mm in size."文件
无文件