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说明
无说明配置
HT-SEM MonitoringOEM 型号描述
The PROVision 3E system combines nanometer resolution, high speed, and through-layer imaging to produce the millions of datapoints needed to correctly pattern today’s most advanced designs, including 3nm foundry-logic chips, GAA transistors, and next-generation DRAM and 3D NAND. With these capabilities, it sees beyond the blind spots of optical metrology, performing accurate measurements across the wafer and between the many layers of a chip to generate the multidimensional data sets needed to achieve the best chip performance and accelerate time to market.文件
无文件
类别
Metrology
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
129806
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
PROVision
类别
Metrology
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
129806
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
HT-SEM MonitoringOEM 型号描述
The PROVision 3E system combines nanometer resolution, high speed, and through-layer imaging to produce the millions of datapoints needed to correctly pattern today’s most advanced designs, including 3nm foundry-logic chips, GAA transistors, and next-generation DRAM and 3D NAND. With these capabilities, it sees beyond the blind spots of optical metrology, performing accurate measurements across the wafer and between the many layers of a chip to generate the multidimensional data sets needed to achieve the best chip performance and accelerate time to market.文件
无文件