The Caliper Mosaic provides overlay metrology solutions, providing cost-effective solutions for today’s advanced 300mm overlay process technologies, available on Lynx platform. 

ONTO / NANOMETRICS / ACCENT / BIO-RAD

CALIPER MOSAIC

In 1992, Nanometrics introduced and began shipping two additions to the NanoSpec/AFT family of Semi-Automatic Table-Top Film Thickness Measurement Systems, the Models 4000 and 4100. The Model 4000 is a lower cost system that provides manual stage and focusing controls.

NANOSPEC 4000

The NanoSpec 6100 is a tabletop film analysis system that provides fast and low-cost measurement capabilities for thin film metrology. It uses non-contact spectroscopic reflectometry to measure sites as small as 10µm in diameter on production wafers and can measure wafer substrates in the size range of 75 to 200mm and photomasks from 5 to 9 inches square. The system can measure film thickness in the range of 200Å - 20µm with the visible light source and 25Å - 20µm with an optional UV light source. The upper thickness range can be extended to 70µm with the thick film option. The system also has a motorized, precision x-y sample stage with a resolution of better than 1µm and a high-resolution color graphics display that provides contour and 3D film thickness mapping.

NANOSPEC 6100

75 mm to 200 mm substrates Variety of measurement modes Manual stage.

NANOSPEC 2100

CALIPER ULTRA

NANOSPEC 210

The QS1200 is a desktop FTIR metrology tool designed for advanced semiconductor fabs. It is used for dopant monitoring, epi thickness measurement, and other applications. The tool can accommodate SEMI standard wafers of 100, 125, 150, 200, and 300mm diameter, as well as odd shaped wafer pieces and 2mm thick silicon slices. An optional single wafer mapping stage is available for all wafer sizes. The QS1200 also features unique algorithms for instant qualification of SOI, SiC, and other epitaxial films. Its built-in intelligence extends its applicability to almost every film material imaginable. Additionally, it is versatile enough to qualify the thickness of recycled test wafers for rapid payback. This tool provides a new level of integration of the FTIR technique utilizing proven optical technology.

QS1200

The NanoSpec 9100 is an advanced film analysis system that combines DUV-NIR spectroscopic ellipsometry and DUV-visible spectroscopic reflectometry. It can handle 75mm to 200mm wafers and is equipped with N2000, the first metrology software that meets the SEMI user interface standard E95-0200. The system is designed for optical-telecom and wireless device manufacturing and can handle advanced materials and processes with speed and precision.

NANOSPEC 9100

The SiPHER is a fully automated photoluminescence metrology system for the detection and mapping of 300mm substrate defects and metallic contamination. SiPHER detects and quantifies near surface and bulk metallic contamination in both bulk silicon and silicon epitaxial layers.

SiPHER

The NanoSpec 9000b is a 300  millimeter-based  system that  incorporates all the features of the 9000i. This system is interchangeable  with industry  conforming load ports for simplified mechanical integration.

NANOSPEC 9000b

The NanoSpec 8000XSE is a stand-alone, automated thin film measurement system that can handle wafers ranging in size from 75 to 200 millimeters in diameter. It includes a fully integrated spectroscopic ellipsometer for ultrathin and multiple film stack measurement applications. An FTIR option can be added to measure the thickness of epi-silicon. The 8000XSE also offers a standard mechanical interface with mini-environment enclosures for use in ultra-clean manufacturing facilities and can be configured to handle substrates used in the magnetic recording head industry. 

NANOSPEC 8000XSE

Epilayer uniformity defects and contamination, with automated wafer handling.

RPM SIGMA

UNIFIRE 7900-L

The NanoSpec 3000 film thickness measurement system is a state of the art, small spot spectroscopic reflectometer, built on a simple to use tabletop platform. A modern solid state linear diode array reflectometer is used to insure measurement speed and accuracy. The NanoSpec 3000 provides scanning from 480 to 800nm and can measure single-layer films such as oxide, nitride and photoresist, as well as multiple layer film stacks. Measurements can also be made on a \vide variety of other substrates including silicon, aluminum and gallium arsenide. 

NANOSPEC 3000

The Nanometrics Atlas™ is an advanced metrology system that can accommodate both 200 or 300 mm wafer metrology. It features a dual-arm robot, high-precision stage, and high-speed focus system. The system also boasts robust pattern recognition, improved thickness reproducibility, and superior throughput. The N2000 software interface and advanced automation are compliant with industry standards, and the NanoNet feature provides system-to-system matching and seamless recipe transferability. The Atlas can be configured with a combination of metrology modules, including Spectroscopic Reflectometer (SR), Spectroscopic Ellipsometer (SE), Optical Critical Dimension (OCD), Diffraction Based Overlay (DBO), and Wafer Stress/Bow.

ATLAS

Caliper élan is an advanced 300mm overlay control system from Nanometrics. It is the most advanced overlay metrology solution from the company, building on the foundation of the original Caliper overlay inspection tool. Élan offers a cost-effective solution for advanced IC manufacturing processes, with a refined optics head and advanced focusing and algorithms. It provides a 50% improvement in overlay measurement uncertainty and greater than 50% MAM time improvement. It is production-ready, with GEM SECS suite and Automated Material Handling System integration as standard. The SynRG option supports waferless recipe creation, using advanced image simulation methods to produce robust, production-ready recipes. Élan is compatible with 200mm or 300mm wafers and offers a variety of handler configurations.

CALIPER ELAN

The RPMBlue™ is a photoluminescence (PL) mapping system designed specifically for the HB-LED market. It is used to measure the properties of epitaxial layers in HB-LEDs. The system is designed to provide accurate, precise, and reliable PL spectral metrology across the entire wavelength range. This includes high-Al content AlGaN alloys for GaN FET’s and UV lasers/LED’s to communication laser applications in the NIR and everything in between. The RPMBlue™ is the industry standard high-volume, production-oriented photoluminescence mapping system. By tuning the system capabilities to your control and measurement needs for the production line, the system becomes fast and economical.

RPMBLUE

The RPM2000 is a Photoluminescence (PL) Mapping Tool designed specifically for the Compound Semiconductor market. It can handle substrate sizes of 75mm, 125mm, and 150mm and is used for detecting substrate defects and composition. Photoluminescence is a well-established, non-contact, non-destructive technique used in the development and process control of semiconductors. Room temperature PL wafer maps provide vital information on the uniformity of alloy composition, material quality, and defects in substrates, epilayers, and device structures. The RPM2000 has been designed to obtain whole wafer PL maps in a fraction of the time previously associated with this sort of measurement, giving the ability to measure and assess wafers between production runs. The primary benefit is that rapid feedback and remedial action can be implemented should wafer parameters be out of specification, avoiding wasted production runs thus saving time and costs. In addition, the speed of measurement also makes the incoming inspection and qualification of bought-in wafers a quick and easy task.

RPM2000

The QS-300 is a bench top FT-IR system designed for the analysis of semiconductor material in Fabs and R&D facilities. It features high performance optics with maximum optical throughput, providing precise and accurate measurements in both reflection and transmission modes. The system also has an innovative sample compartment that can accommodate single wafers or slugs of 3 to 200mm, as well as non-standard shape and size silicon substrates. This makes it a versatile tool for analyzing a wide range of semiconductor materials.

QS-300

The NanoSpec 9200 is an advanced film analysis system that provides DUV-visible spectroscopic reflectometry. It has a small footprint and high throughput, making it a highly efficient tool for analyzing film thickness and material optical constants. The system can handle both 150mm and 200mm wafers and is capable of measuring up to 200 wafers per hour. It features the latest generation spectroscopic reflectometer, pattern recognition, auto-focus, auto-positioning stage, and robotic wafer handling capabilities. This makes it a fast, reliable, compact, and cost-effective tool for volume production in the IC manufacturing industry.

NANOSPEC 9200

NANOSPEC 180

The NanoSpec 9300 is a stand-alone, automated thin film measurement system that can handle both 200 and 300 millimeter diameter wafers. It can be configured with a DUV to NIR spectroscopic ellipsometer for ultrathin, multiple film stack, and DUV lithography measurement applications. Additionally, an FTIR option can be added to measure the thickness of epi-silicon. The system can also include a mini-environment enclosure and wafer load ports that are compatible with industry standards. The 9300 conforms to the new industry standards for 300 millimeter wafer handling automation and features a Windows NT software platform that conforms to the newly established SEMI user interface standard. The 9300 was developed using technologies from integrated film thickness systems, allowing for easy transfer of measurement recipes between integrated and stand-alone film metrology systems.

NANOSPEC 9300

The NanoOCD/DUV 9010b is a SEMI BOLTS compatible, 300 millimeter based system that incorporates all the features of the NanoOCD/DUV 9010. By conforming to the industry standard BOLTS mounting system, the NanoOCD/DUV 9010b is interchangeable with industry conforming load ports for simplified mechanical integration.

9010b

QS2200A

NANOLINE 50-2C

The NanoOCD/DUV  9010 was also introduced in the third quarter of 2003, and is the first  integrated  metrology tool to combine two measurement technologies on a single platform.  The NanoOCD/DUV  9010  incorporates both  ultraviolet  optical  critical  dimension  (OCD)  spectroscopic ellipsometry and deep ultra violet (DUV)  spectroscopic  reflectometry. The  NanoOCD/DUV  9010  provides  thin  film and film  stack  thickness measurements  on pads as well as  oxide,  nitride  and  trench  profile measurements  on arrays in a single  tool.  The  combined  technologies provide  a  complete  measurement  solution  over the  entire  range of measurement requirements for each process step. This complete metrology capability can be utilized across a number of lithography,  deposition, copper  planarization,   dielectric  planarization,  poly-Si  etch  and  dielectric etch applications.

9010

NANOSPEC 200

Available in both tabletop and standalone configurations, the Nanopsec II film analysis system closes the loop between engineering and research activity and final production use of recipes and analysis algorithms. 

NANOSPEC II

The  NanoSpec  9000i  is  an  ultra-compact   measurement  system  designed  for integration into  semiconductor  wafer processing  equipment.  The system can be used in several wafer film process steps including metal  deposition,  CMP, CVD, photolithography  and etch.  In its basic  configuration,  the 9000i is equipped with visible wavelength spectroscopic reflectometry. 

NANOSPEC 9000i

The QS-408M is a manual wafer loading FT-IR system designed for semiconductor material characterization. It incorporates an X-Y stage that allows for unlimited user-defined mapping patterns and contour maps to be generated. The system can accommodate single wafers or slugs of 3" to 200mm, as well as non-standard shape and size silicon substrates. The QS-408M software has communication capability to host computers under the SECS I and II protocols. This makes it a versatile and powerful tool for semiconductor material analysis.

QS-408M

Vertex is the latest addition to the RPM family and is designed to deliver industry-leading accuracy, repeatability, and tool-to-tool matching. It is a PL Mapping System with Power Density Control that brings the PL measurement process under control, ensuring that your epitaxial process stays firmly under control. Vertex provides accurate, precise, and repeatable PL metrology across the entire wavelength range, including high-Al content AlGaN alloys for GaN FET’s and UV lasers to the Antimonides out in the MIR and everything in between. It offers a catalog of more than 15 standard lasers and the ability to fiber-feed a virtually unlimited array of sources. The monochromator can be fitted with up to three gratings and two array detectors, and every optical component is selected under computer control. Vertex also contains its own built-in spectral source for monochromator calibration. The system can accommodate up to 4 internally mounted lasers, two of which feature a continuously-variable power control with feedback loop. Large lasers can be fiber-connected, and for film thickness measurements, the system can be fitted with a white light source. The Vertex software also includes a Fourier Transform facility for data interpretation.

VerteX

NANOSPEC 9310

The NanoSpec 8000X is a versatile tool designed for the automated measurement of wafers ranging in size from 75mm to 200mm. It comes with a standard mechanical interface and can be equipped with mini-environment enclosures, making it suitable for use in ultra-clean manufacturing facilities. Additionally, the 8000X can be configured to handle substrates used in the magnetic recording head industry. With these features, the NanoSpec 8000X is a reliable and adaptable solution for a variety of wafer measurement needs.

NANOSPEC 8000X

he HL5500PC is a high-performance Hall Effect Measurement System designed for measuring resistivity, carrier concentration, and mobility in semiconductors. It is modular in design, allowing for easy upgrades, and is suitable for a wide range of materials, including silicon and compound semiconductors. The system has both low and high resistivity measurement capabilities, with an optional temperature range from below 4K to as high as 600º C. It features an intuitive Microsoft Windows user interface and an optional mapping stage for wafer uniformity measurements. No programming experience is required to set up or use the HL5500PC.

HL5500

The QS2200 is a 200mm FTIR metrology tool designed for non-destructive wafer analysis. It is used for the characterization and measurement of semiconductor materials and device manufacturing. The QS2200 model is available in two configurations: the QS2200A, an automated system with two open cassette stations, and the QS2200ME, an automated system with an indexer and open cassette system. The QS2200 series incorporates a universal stage that adjusts automatically to different wafer sizes (100, 125, 150, and 200mm) and unique algorithms that deliver instant qualification of SOI, SiC, and other epitaxial films. Additionally, it is versatile enough to qualify the thickness of recycled test wafers for rapid payback. This tool is built with intelligence that extends its applicability to almost every film material imaginable.

QS2200

The NanoSpec 8300X is a film thickness measuring system designed by Nanometrics for the semiconductor industry. It was first introduced in July 1996 at the SEMICON/West trade show and is capable of handling both 200mm and 300mm diameter wafers. The system incorporates both a spectroscopic ellipsometer and spectrophotometer, enabling it to accurately measure and analyze virtually any dielectric film used in semiconductor manufacture today. The development of the NanoSpec 8300X was part of a project launched by SEMATECH, a consortium of large U.S. semiconductor manufacturers, to develop tools for the eventual industry shift to the manufacture of ICs on 300mm semiconductor wafers, which are designed to allow lower production cost due to the ability to simultaneously manufacture many more chips per wafer.

NANOSPEC 8300X

The Model 4150, an enhanced version of the Model 4100 introduced in the middle of 1994, provides automated stage and focusing systems for hands-off uniformity maps.

NANOSPEC 4150

M6100UV-L6

The Trajectory T³ is a cutting-edge metrology module developed by Nanometrics for monitoring and controlling critical processes in semiconductor fabs worldwide. It has been approved for integration by leading process tool manufacturers and has set new standards for speed, reliability, and cost. With its robust large area optical collectors, simple yet powerful spectral detectors, and a MTBF of over 10,000 hours, the Trajectory T³ minimizes cost while maximizing performance. Capable of processing over 250 wafers per hour, it can measure every process wafer even on the fastest process tools. By enabling process tools to measure thicknesses inside the tool and inside the wafer’s patterned devices, the Trajectory T³ delivers unparalleled advantages in speed, reliability, and cost. It is truly changing the game in integrated metrology.

TRAJECTORY T3

The Atlas offers high-accuracy, high-precision metrology for wafer characterization and can be configured for 150mm to 300mm wafer sizes or 6-inch masks and reticles. The Altas XP is the newest product line in the Atlas family and addresses thin film and OCD for the 45nm and 32nm nodes.

ATLAS XP

VERTEX-SM-110	

The Atlas II+ is an advanced Optical CD (OCD) Metrology System developed by Nanometrics. It is designed for high-performance process control metrology and incorporates innovations in optical components, precision wafer positioning, and new software analysis. The system is capable of measuring the smallest semiconductor design features, including complex device structures at 1x nm technology nodes. It also provides unprecedented stability in focus performance and can measure a range of structures, including asymmetric spacers and 3-D gratings. The Atlas II+ is compatible with Nanometrics’ Lynx cluster metrology platform and can be configured with spectroscopic reflectometer (SR) and spectroscopic ellipsometer (SE) metrology modules. It also offers a doubling of wafer throughput and an order of magnitude improvement in wafer positioning precision, enabling significant increases in data volume and lowering the system’s cost of ownership. Additionally, it can be optionally equipped with NanoCD Suite for OCD and wafer stress/bow measurement capabilities.

ATLAS II+

M6100UV

The Iris C1 system combines a proprietary spectroscopic ellipsometry solution from the Atlas family with Onto Innovation’s industry leading AI-Diffract™ OCD analysis software, enabling high precision control of every critical semiconductor process step. The system incorporates a dual-arm robot, high-precision stage and high-speed focus system. The system also features advanced pattern recognition, improved thickness reproducibility and throughput. 

IRIS C1

NANOLINE V

NANOLINE 50

NANOLINE CDR III

Dopant concentration and layer thickness, with faster wafer handling.

STRATUS

The NanoSpec 9300is stand-alone, automated thin film measurement system is a DUV-visible  spectroscopic  reflectometer  based system that provides direct recipe transfer to Nanometrics Integrated Metrology and stand-alone systems. This system can also  include a  mini-environment  enclosure  and wafer load ports  compatible with industry  standards. 

NANOSPEC 9300is

The Mosaic II provides cost effective overlay metrology solutions, for today's advanced 300mm overlay process technologies, and is available on Lynx platform.

CALIPER MOSAIC II

Lattice strain and structure, composition and layer thickness for gallium nitride materials.

Vektor-GaN

The Nanometrics FLX is a flexible metrology system that offers cost-efficiency and high throughput for 300 mm standalone metrology. It is based on Nanometrics’ proven integrated metrology solutions and can support up to four integrated metrology modules simultaneously. The tool can mix-and-match any combination of modules to form a complete metrology solution for lithography, CMP, etch, and CVD/deposition processes. This capability accelerates process development through parallel development of integrated metrology solutions. The system offers industry-leading throughput of 250-500 wafers fueled by dual multi-axis wafer-handling robots.

NANOSPEC 181

VERTEX SM-230

The Company introduced a new film thickness metrology system for flat panel displays, the Model 5500. The flat panel display industry, including displays for lap-top computers, is projected to grow rapidly. Flat panel displays utilize transparent films which must be accurately measured. The Model 5500 was developed by the Company's Japanese subsidiary, which has been working closely with a number of Japanese flat panel display manufacturers over the last several years. The Model 5500 is fully automated and accommodates substrates up to 650 x 550 mm. Virtually all optically transparent films used in the manufacture of flat panel displays can be measured.

NANOSPEC 5500

NANOSPEC 4100

QS4300

The QS-500 is a state-of-the-art FT-IR instrument designed for non-destructive analysis of semiconductor wafers. It is fully automated and ideal for use in both Fabs and R&D facilities. The high-performance optics provide maximum throughput, ensuring precise and accurate measurements. The instrument also features automatic computer selectable reflection and transmission modes. The robotic wafer handler, with an integrated pre-aligner, provides a compact footprint and the ability to sort using two cassette stations. Additionally, the system incorporates an X-Y stage, allowing for unlimited user-defined mapping patterns on samples and the generation of contour maps. Overall, the QS-500 is a powerful tool for semiconductor wafer analysis.

QS-500

The Atlas II is an advanced 300mm metrology system from Nanometrics, designed for high-performance process control metrology. It incorporates innovations in optical components, precision wafer positioning, and new software analysis to enable measurements of the smallest semiconductor design features, including complex device structures at 1x nm technology nodes. The system provides unprecedented stability in focus performance, allowing precise and repeatable measurements of critical device features. It is capable of on-device measurement, eliminating the need for scribe-line marks and enabling direct and reliable process control of device manufacturing. The Atlas II also offers a doubling of wafer throughput and significant improvement in wafer positioning precision, lowering the system’s cost of ownership. It is compatible with Nanometrics’ Lynx cluster metrology platform and can be configured with Spectroscopic reflectometer (SR) and Spectroscopic ellipsometer (SE) metrology modules, with optional additions such as NanoCD Suite for OCD and wafer stress/bow.

ATLAS II

The Atlas-M further extends the versatility of this 300mm platform to provide fully automated mask and reticle measurements. The system is capable of housing up to five metrology technologies including polarized, normal incidence spectroscopic ellipsometry for linewidth profile and critical dimensions, spectroscopic reflectometry for films and film stacks, UV and deep UV spectroscopic ellipsometry for ultra-thin films and film characterization, diffraction-based overlay technology for layer-to-layer registration measurement, and film stress/wafer bow measurements. The Atlas offers high accuracy, high precision metrology for wafer characterization and can be configured for 200mm and 300mm wafer sizes or 6-inch masks and reticles.

ATLAS-M

Same as 8300X. Spectroscopic ellipsometer. The 8300XSE includes a fully integrated spectroscopic ellipsometer which expands the measurement capabilities of the basic product, especially in ultrathin and multiple film stack measurement applications.


NANOSPEC 8300XSE

The NanoOCD 9020, a 200 millimeter-based system that incorporates our newly developed edge-gripping vacuum wafer stage and OCD technology for the measurement of critical dimensions on semiconductor wafers. The system is designed for integration into the vacuum chamber of semiconductor wafer etch processing equipment.

NanoOCD 9020

Q200I 

QSFRS, or the Full Rod Oxygen Analyzer, is an automatic ingot scanning FT-IR spectrometer system designed to determine impurities in bulk silicon in crystal growing areas. It is capable of determining interstitial oxygen impurities in bulk silicon ingots and includes the ability to calibrate, correct, and monitor daily analysis using SPC control standards. QSFRS has an optional built-in stage for smaller pieces and a mobile cart for sampling whole rods. It also has built-in safety interlocks and signal lights to meet production environment safety requirements. This system is a valuable tool for ensuring the purity of silicon ingots in the crystal growing process.

QSFRS

The 8000S was designed to handle the round and square wafer-like pucks, typically 2 to 3 mm thick, which are used in the magnetic recording head industry.  As in semiconductor manufacturing, magnetic recording head manufacturing involves a variety of deposition and patterning steps, some with requirements more stringent than those found in semiconductor manufacturing.  In particular, magnetic recording head manufacturers are required to deposit more ultra-thin metal films than semiconductor manufacturers.

NANOSPEC 8000S

The NanoOCD 9010M was  introduced in the third quarter of 2003,  and the first optical critical  dimension (OCD)  integrated  metrology tool for   masks   and   reticles.    The   NanoOCD   9010M   utilizes   our production-proven OCD metrology, and enables non-destructive, real-time measurement  and  profiling  of  critical  features on  photomasks  and reticles  without the limitations and drawbacks  associated with CD-SEM metrology.  Current  CD-SEM  technology  appears  to  be  reaching  its theoretical limits for making critical dimension  measurements on these substrates.  Photoresist-on-chrome-on-glass  features found on reticles and  masks  suffer  severe  charging  during  CD-SEM  metrology  making critical dimension  measurements  impossible.  OCD is a non-destructive technology   that  provides   information  not  available  from  CD-SEM measurements.


NanoOCD 9010M

Illumina is a compact manual FT-IR system that belongs to a new class of innovative instruments for optical, non-contact measurements of epi wafers. With over 25 years of experience, it provides accurate and repeatable characterization of multi-layer, compound semiconductor wafer parameters such as epi thickness and doping concentration. This critically affects the performance of optoelectronic devices such as P-I-N and avalanche photodiodes, IR lasers, VCSELs, LEDs, and waveguides, allowing for higher yields and lower costs. Using state-of-the-art Fourier Transform Infrared technology and model-based analysis, epi thickness maps can be obtained in minutes on both test and product wafers. An optional small spot size minimizes edge exclusion.

ILLUMINA

The NanoOCD  9000 is a 300  millimeter-based  system that  incorporates  the newly developed OCD technology for the measurement of critical  dimension on semiconductor  wafers,  and is designed for integration  into  semiconductor wafer  processing  equipment.  The system  can be used in  several  critical processing steps including photolithography and etch.

NanoOCD  9000

Imperia is a photoluminescence (“PL”) full wafer imaging and mapping system designed for high-volume compound semiconductor metrology applications including power control and photonics applications adding significant inspection and substrate metrology capability to the established PL fleet.

IMPERIA

In 1994, the Company's Japanese subsidiary introduced two table-top systems, the Models 5000 and 5100 specifically engineered to meet the needs of the Japanese market. These systems are modified versions of the Models 4000 and 4150, respectively. 75 mm to 200 mm substrates Wide measurement range Manual stage Programmable software.

NANOSPEC 5000

The Q240AT incorporates the same measurement technology as the Caliper, and delivers the same advanced measurement capabilities for 200mm wafer sizes.


Q240AT

The DiVA D210 is a dual-channel synchronous pulse source measurement unit from Accent Optical Technologies. It provides pulse widths down to 100ns and a dc measurement capability. The output voltages range from -10V to +10V with a maximum current of 500mA. It supports FETs, HEMTs, NPN and PNP bipolar/HBT and diodes, and has an intuitive Windows® interface. It is a compact single box solution with high throughput and can be controlled from 3rd party programs. It also has I(V) parameter fitting for HEMT and FET models.

DiVA D210

The NanoSpec® 9000 Series is an Integrated Metrology® Copper Laser Profiler System designed for integration into semiconductor wafer processing equipment. The NanoSpec 9000 and NanoSpec 9000i are ultra-compact measurement platforms for 200mm and 300mm film analysis, respectively. They can be used in several wafer film process steps including metal deposition, CMP, CVD, photolithography and etch. The systems use non-contact visible and/or DUV reflectometry to perform fast and accurate measurements of film thickness and uniformity. The NanoSpec 9000b (BOLTs) is a 300mm system with all the features of the NanoSpec 9000 and is interchangeable with industry conforming load ports for simplified mechanical integration.

NANOSPEC 9000

ATLAS XPM

RPM 4000

The Atlas III+ is a platform for advanced process control metrology. It has been qualified at multiple memory and foundry/logic device manufacturers, each utilizing the company’s proprietary analysis software including NanoDiffract® and SpectraProbe™. The Atlas III+ combines spectroscopic ellipsometry (SE) with full Mueller Matrix capability and broadband reflectometry (SR) to provide metrology performance while also increasing productivity on the most demanding devices, both in development and high-volume production. The Atlas III+ is the latest in the family of combination SE/SR systems for advanced fab metrology and process control, and is an automated system supporting advanced OCD and thin-film metrology with proprietary ellipsometry and reflectometry technologies. The Atlas III+ delivers best-in-class precision and repeatability at a faster overall system throughput, supporting a broad variety of process control applications. When combined with NanoDiffract, the Atlas III+ enables high-fidelity metrology on the most complex three-dimensional structures. When utilizing SpectraProbe, the Atlas III+ provides unique insight into on-device and in-die control for advanced yield learning and process optimization. Overall, the Atlas III+ is a powerful tool for advanced process control metrology.

ATLAS III+

Based on a common HBLS optical design derived from our seventh generation Atlas platform and best-in-class deep ultraviolet (DUV) optics, the Iris R1 system offers maximum sensitivity and accuracy to CMP process excursions and enables device makers to establish APC control solutions with high-accuracy feedback. With SpectraProbe™ and NanoDiffract® analysis solutions enabling direct measurements within device and active areas, users are now able to monitor minor process excursions and optimize their processes for higher yields.

IRIS R1

The NanoSpec 8000 is a fully automated film thickness measurement system introduced by Nanometrics. It is designed to meet the speed, measurement, performance, and reliability requirements essential to high-level factory control in today’s semiconductor mega-fabs and magnetic head production. The system can be programmed to run operator-free and offers a wide range of film thickness measurements for 75 mm to 200 mm wafers. Additionally, it boasts a low cost of ownership.

NANOSPEC 8000

NANOLINE 50-2

CALIPER MOSAIC III

Lattice strain and structure, composition and layer thickness for gallium arsenide, indium phosphide and silicon germanium materials.

Vektor-DCD

The new Atlas V metrology system is designed to measure several key steps that include buried features, not visible by CD-SEM and other techniques. Through remarkable improvements in the optical systems, mechanical sub-systems and software algorithms, the Atlas V system can precisely measure the very subtle variations for device parameters and reveal weak process corners for engineers to improve their process robustness in the fab. The sensitivity of Atlas V metrology enables these critical dimensions to be measured with high accuracy and sensitivity, extending the capability of optical solutions for generations of devices and eliminating the need for other slower process control techniques.
The Atlas V technology enables the performance needed for customers’ development of GAA/3D NAND/DRAM and is over 100 times faster than X-ray solutions for these structures. 

ATLAS V

Electron mobility in very high resistivity films or at extremely low current levels.

HL5580

The QS2200 and QS3300 are Fourier-Transform Infra-Red spectrometers designed for non-destructive wafer analysis. These systems are used for the characterization and measurement of semiconductor substrates as well as in device manufacturing. The QS3300 is a production version which supports high-volume 300mm manufacturing for various applications: boron and phosphorus concentration in BPSG films, atomic hydrogen concentrations in silicon nitride passivation layers, fluorine in FSG films, epitaxial thickness, concentrations of interstitial oxygen and substitutional carbon in silicon.

QS3300

The NanoSpec tabletop systems provide a broad range of thin film measurement solutions at a lower entry price point. The NanoSpec 3000 is a basic, manual system while the 6100/6150 models feature semiautomatic wafer handling or staging.

NANOSPEC 6150

ATLAS XP+

The NanoSpec 8300 is a film thickness measuring system designed by Nanometrics for the semiconductor industry. It is capable of handling both 200mm and 300mm diameter wafers. The system incorporates both a spectroscopic ellipsometer and spectrophotometer, enabling it to accurately measure and analyze virtually any dielectric film used in semiconductor manufacture today.

NANOSPEC 8300

The Iris T1 is a spectroscopic ellipsometer system that provides accurate, repeatable in-line thickness and optical constant measurements of single and multi-layer dielectric films for fab-wide applications. Built on the same field-proven Atlas platform, the Iris T1 system leverages the most recent advances in optics and algorithms, making it best-in-class for performance and cost-of-ownership. 

IRIS T1

CDS200 is a 200mm Critical Dimension Control System that offers fast and non-destructive critical dimension metrology. It is designed for use in R&D, production, and quality control environments, providing improved process control and high throughput. The system is fully automated and can accurately measure critical dimensions as small as 70nm, while also determining cross-sectional profile and layer thickness. This makes it an ideal tool for ensuring precise measurements and process control in a variety of applications.

CDS200

Vertical alignment of device structures extendible to 90 nanometers on 200mm wafers.

Q200

The recently introduced Nanometrics Orion, Advanced Overlay Control System provides enhanced measurement performance and higher wafer throughput and replaces the original Metra line of products. The system is based on the highly successful Atlas platform and offers high throughput in excess of 180 wafers per hour. Orion utilizes a proprietary optical system to provide low total measurement uncertainty (TMU), enabling 1 nanometer, 3-sigma precision in overlay control applications. Orion’s aerial image metrology with proprietary digital image folding tolerates wide process variations and reduces the possibility of erroneous data. Both attributes are crucial elements in attaining high yields in 200mm and 300mm volume production.

ORION

NANOSPEC 6100X

NANOSPEC 215 

Lattice strain and structure, composition and layer thickness for strained silicon and SOI materials.

Vektor-SSi

Q22I

The Unifire system enables users to measure multiple parameters at any given process step in the advanced packaging process flow for critical dimension, overlay, and topography applications.

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