说明
无说明配置
Technology: Low Conherence IR interferometry for step high measurement Applications: High A/R TSV depth measurement for 200 and 300mm wafer (Via first & Middle) Benefits: Non destructieve Technology Fast and easy to use CCD camera for spot positioning and pattern recognition Adjustable Metrology spot size TSV diameter > 2um A:R up to 30 Calibration and maintenance freeOEM 型号描述
未提供文件
无文件
FOGALE Nanotech
DEEPROBE 300-M
已验证
类别
Metrology
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
65311
晶圆尺寸：
未知
年份：
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
FOGALE Nanotech
DEEPROBE 300-M
类别
Metrology
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
65311
晶圆尺寸：
未知
年份：
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Technology: Low Conherence IR interferometry for step high measurement Applications: High A/R TSV depth measurement for 200 and 300mm wafer (Via first & Middle) Benefits: Non destructieve Technology Fast and easy to use CCD camera for spot positioning and pattern recognition Adjustable Metrology spot size TSV diameter > 2um A:R up to 30 Calibration and maintenance freeOEM 型号描述
未提供文件
无文件