说明
LightSPEED "Standard" (200mm compliant) Dark Field & Doppler detection capability Sensitivity down to 50nm on Si Transparent and opaque wafers Automated Defect Classification (ADC) Standard result file generation FFU on module Throughput • High Sensitivity Mode : 25 wafers per hour High ThroughtPut Mode: 70 wafers per hour EFEM two Loadports with vacuum handling EFEM two load ports SMIF pod 200mm compliant Light tower 4 colors Wafer ID reader (Backside) FFU on EFEM Integration of RFID reader for SMIF pod TAG (design and material provided by OSRAM) Factory Automation: Including SECS/GEM, compatible with ATV (E84 compliant with exception of PIO sensor配置
Application: Frontside Unpattern inspection 2 GaAs (thickness 675 um) Sapphire (thickness 600-2000 um) SiliconOEM 型号描述
未提供文件
无文件
类别
Metrology
上次验证： 11 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
147462
晶圆尺寸：
8"/200mm
年份：
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
UNITY SEMICONDUCTOR / HSEB
Lightspeed
类别
Metrology
上次验证： 11 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
147462
晶圆尺寸：
8"/200mm
年份：
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
LightSPEED "Standard" (200mm compliant) Dark Field & Doppler detection capability Sensitivity down to 50nm on Si Transparent and opaque wafers Automated Defect Classification (ADC) Standard result file generation FFU on module Throughput • High Sensitivity Mode : 25 wafers per hour High ThroughtPut Mode: 70 wafers per hour EFEM two Loadports with vacuum handling EFEM two load ports SMIF pod 200mm compliant Light tower 4 colors Wafer ID reader (Backside) FFU on EFEM Integration of RFID reader for SMIF pod TAG (design and material provided by OSRAM) Factory Automation: Including SECS/GEM, compatible with ATV (E84 compliant with exception of PIO sensor配置
Application: Frontside Unpattern inspection 2 GaAs (thickness 675 um) Sapphire (thickness 600-2000 um) SiliconOEM 型号描述
未提供文件
无文件