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说明
SONIX Quantum 350 (SAM) Scanning Acoustic Tomography (SAT), also called Scanning Acoustic Microscope (SAM), is a method for analyzing materials by measuring the reflecting speed and energy of an ultrasonic wave which is transmitted through the material of a certain thickness. ** Operational, but transducer & adotor cable missing.配置
Working Testing modes: A-scan (ultrasonic signal). B-scan (2D reflective cross-section detection/ imaging). C-scan (2D reflective plane detection/ imaging). Through-scan (pass-through detection/ imaging). Applications / Features: Normally used to detect delamination or cracks inside the package, SAT is capable of detecting micro gaps down to 0.13μm. IC package level structure analysis IC package quality on PCBA level PCB/IC substrate structure analysis Wafer level structure analysis WLCSP structure analysis CMOS structure analysis Imaging resolution : 0.5 micron Scan speed : Max. 1000 mm/s Scan area : 350 mm x 350 mmOEM 型号描述
未提供文件
无文件
类别
Microscope
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
55840
晶圆尺寸：
8"/200mm
年份：
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SONIX
QUANTUM 350
类别
Microscope
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
55840
晶圆尺寸：
8"/200mm
年份：
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
SONIX Quantum 350 (SAM) Scanning Acoustic Tomography (SAT), also called Scanning Acoustic Microscope (SAM), is a method for analyzing materials by measuring the reflecting speed and energy of an ultrasonic wave which is transmitted through the material of a certain thickness. ** Operational, but transducer & adotor cable missing.配置
Working Testing modes: A-scan (ultrasonic signal). B-scan (2D reflective cross-section detection/ imaging). C-scan (2D reflective plane detection/ imaging). Through-scan (pass-through detection/ imaging). Applications / Features: Normally used to detect delamination or cracks inside the package, SAT is capable of detecting micro gaps down to 0.13μm. IC package level structure analysis IC package quality on PCBA level PCB/IC substrate structure analysis Wafer level structure analysis WLCSP structure analysis CMOS structure analysis Imaging resolution : 0.5 micron Scan speed : Max. 1000 mm/s Scan area : 350 mm x 350 mmOEM 型号描述
未提供文件
无文件