说明
TSV Cu Anneal配置
TSV Cu AnnealOEM 型号描述
The SAO-302LP system is designed based on a resistively heated, stacked process module technology to address ambient controlled, low temperature annealing applications up to 450°C. The system processes five wafers simultaneously and provides excellent process repeatability and stability at a minimum cost of ownership.文件
无文件
TEL / TOKYO ELECTRON / WAFERMASTERS
SAO-302LP
已验证
类别
Oven
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
75747
晶圆尺寸：
12"/300mm
年份：
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON / WAFERMASTERS
SAO-302LP
类别
Oven
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
75747
晶圆尺寸：
12"/300mm
年份：
2000
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
TSV Cu Anneal配置
TSV Cu AnnealOEM 型号描述
The SAO-302LP system is designed based on a resistively heated, stacked process module technology to address ambient controlled, low temperature annealing applications up to 450°C. The system processes five wafers simultaneously and provides excellent process repeatability and stability at a minimum cost of ownership.文件
无文件