Design, development, manufacture, sales and after services of semiconductor manufacturing equipment (molding equipment, automation equipment), dies and precision parts.

Molding System

- High precision and high quality manual molding system compatible with FOWLP/FIWLP/EWLP 
- High-precision platen parallelism achieved by 4-axis linear motion motor (AYC Patented) 
- Equipped with a high-pressure 85-ton press that enables MUF molding technology 
- Resin can be supplied in liquid, granule or sheet form
- SEMI S2 compliant, SEMI S8/CE optional

YAMAHA / APIC YAMADA

WCM-330 MS

FOWLP/FIWLP/eWLB compatible, high precision, high quality, fully automatic molding system
High precision platen parallelism by adopting 4-axis linear motion motor
Equipped with a high-pressure 85-ton press that enables MUF molding technology
Both liquid and granular resin can be supplied.
Abundant optional functions such as chip counting, visual inspection, post-curing, IP camera, etc.
SEMI S2 compliant, SEMI S8/CE optional
FOWLP: Fan-Out Wafer Level Package
FIWLP: Fan-In Wafer Level Package
EWLP: Embedded Wafer Level Package

WCM-330

MS-150HP

WCM-300L

COMBO-300

WCM-300

LTM-120L

CDIM	

Compact manual molding system. This system is the manual transfer molding system, designed for encapsulation of semiconductor device, versatile electronics devices, ECU for automobile etc. The system is recommended for the development work and small lot production.

YAMAHA / APIC YAMADA

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WCM-330 MS

LTM-120L

CDIM

GTM-X

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