Molding System

- High precision and high quality manual molding system compatible with FOWLP/FIWLP/EWLP 
- High-precision platen parallelism achieved by 4-axis linear motion motor (AYC Patented) 
- Equipped with a high-pressure 85-ton press that enables MUF molding technology 
- Resin can be supplied in liquid, granule or sheet form
- SEMI S2 compliant, SEMI S8/CE optional

Design, development, manufacture, sales and after services of semiconductor manufacturing equipment (molding equipment, automation equipment), dies and precision parts.

WCM-330 MS

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