说明
无说明配置
无配置OEM 型号描述
sophisticated system providing total solution on sorting, six-side inspection and flexibility for an individual unit testing and laser marking. Applications include wafer level packages / dice inspection comprising micro crack inspection at six sides and sorting according to wafer mapping generated from the upstream processes.文件
无文件
类别
Packaging
上次验证： 19 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
146071
晶圆尺寸：
未知
年份：
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASMPT / DEK
SUNBIRD
类别
Packaging
上次验证： 19 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
146071
晶圆尺寸：
未知
年份：
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
sophisticated system providing total solution on sorting, six-side inspection and flexibility for an individual unit testing and laser marking. Applications include wafer level packages / dice inspection comprising micro crack inspection at six sides and sorting according to wafer mapping generated from the upstream processes.文件
无文件