说明
无说明配置
无配置OEM 型号描述
The BESI FICO AMS-W40-306 is a molding system used in the semiconductor industry for molding semiconductor devices. The AMS-W40-306 is capable of both die bonding and flip chip bonding processes. The AMS-W40-306 includes advanced mechanisms for handling different types of substrates, such as lead frames, ceramic substrates, or other package types. The "W40" part may refer to a specific platform or series within the BESI FICO AMS product line.文件
无文件
BESI / FICO
AMS-W40-306
已验证
类别
Packaging
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
80099
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / FICO
AMS-W40-306
类别
Packaging
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
80099
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
无配置OEM 型号描述
The BESI FICO AMS-W40-306 is a molding system used in the semiconductor industry for molding semiconductor devices. The AMS-W40-306 is capable of both die bonding and flip chip bonding processes. The AMS-W40-306 includes advanced mechanisms for handling different types of substrates, such as lead frames, ceramic substrates, or other package types. The "W40" part may refer to a specific platform or series within the BESI FICO AMS product line.文件
无文件