说明
VACUUM ASSISTED 3 PRESS TRANSFER MOLD配置
AMS-LM 306OEM 型号描述
Molding is a process where micro chips are encapsulated in plastic. In line with the market trend toward SIP, exposed dies and more complex packages like dual side molding, Besi developed the large substrate molding machine Fico AMS-LM. The Fico AMS-LM can handle substrates of up to 102 x 280mm and can handle all current single and dual sided packages. Large substrates allow a high board utilisation and in combination with deep vacuum, the unique clamp mechanism and the high output of the Fico AMS-LM, performance and yield increase significantly.文件
无文件
BESI / FICO
AMS-LM
已验证
类别
Packaging
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
102516
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / FICO
AMS-LM
类别
Packaging
上次验证： 30 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
102516
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
VACUUM ASSISTED 3 PRESS TRANSFER MOLD配置
AMS-LM 306OEM 型号描述
Molding is a process where micro chips are encapsulated in plastic. In line with the market trend toward SIP, exposed dies and more complex packages like dual side molding, Besi developed the large substrate molding machine Fico AMS-LM. The Fico AMS-LM can handle substrates of up to 102 x 280mm and can handle all current single and dual sided packages. Large substrates allow a high board utilisation and in combination with deep vacuum, the unique clamp mechanism and the high output of the Fico AMS-LM, performance and yield increase significantly.文件
无文件