说明
Silicon wafers, apply back grinding protective tape (BG Tape) to the front side of the wafer before the back grinding (BG) process. Function of polishing tape: Protects the front circuitry during wafer thinning and polishing, prevents chipping, and blocks配置
无配置OEM 型号描述
LINTEC RAD-3500 F/12 is a Packaging system. The RAD-3500 F/12 can produce wafer size of 12”.文件
无文件
类别
Packaging
上次验证： 2 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
150299
晶圆尺寸：
12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LINTEC
RAD-3500 F/12
类别
Packaging
上次验证： 2 天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
150299
晶圆尺寸：
12"/300mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Silicon wafers, apply back grinding protective tape (BG Tape) to the front side of the wafer before the back grinding (BG) process. Function of polishing tape: Protects the front circuitry during wafer thinning and polishing, prevents chipping, and blocks配置
无配置OEM 型号描述
LINTEC RAD-3500 F/12 is a Packaging system. The RAD-3500 F/12 can produce wafer size of 12”.文件
无文件