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LINTEC RAD-3510F/12
  • LINTEC RAD-3510F/12
  • LINTEC RAD-3510F/12
  • LINTEC RAD-3510F/12
  • LINTEC RAD-3510F/12
说明
无说明
配置
CE and ESD N51M M24 compliant 150mm and 200mm wafer diameter processing capability with matching wafer tables Double loadport (2 FOUP loader with 8" mapping, no 6" mapping) BG-Tape cutting and wafer handling using 6-axis robot Non-contact alignment and tape lamination unit Log file download function via LAN Ionizers for ceiling and loadport Manual on paper and digital download in english Preparation for Wafer ID reading function for front side only (reader not included) SECS/GEM Specification (license fee, no customization) PP_SELECT data variable length (software function) Wafer ID reading as task parameter No. 43 (software function) SECS/GEM menu only accessible with PW (software function) Maintenance password "ADWILL2" Total counter reset with max. wafer count 999.999.999 Counter reset with password N2 purge during lamination Wafer thickness limit changed to 3000μm Wafer table cleaning unit Pneumatic tape winder Vacuum cleaner value display on Touchpanel
OEM 型号描述
未提供
文件

无文件

类别
Packaging

上次验证: 60 多天前

物品主要详细信息

状况:

Used


运行状况:

Installed / Idle


产品编号:

89447


晶圆尺寸:

未知


年份:

2018


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

LINTEC

RAD-3510F/12

verified-listing-icon
已验证
类别
Packaging
上次验证: 60 多天前
listing-photo-1005606c3cc14823a1c665af66110858-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/75661/1005606c3cc14823a1c665af66110858/72ab5a2675a04a928003b196c3b8a0ab_a96c1a91c9274837a83597bb3c205913_mw.png
listing-photo-1005606c3cc14823a1c665af66110858-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/75661/1005606c3cc14823a1c665af66110858/ce326cc638b2409ab424a71f9a03dcf4_722581a5fbcf4422901de2b1ac925bd61201a_mw.jpeg
listing-photo-1005606c3cc14823a1c665af66110858-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/75661/1005606c3cc14823a1c665af66110858/843c4f50293c4908b8e01b8c4ee013f8_2bd7c8c608f3420ca169140cd9ac22e51201a_mw.jpeg
listing-photo-1005606c3cc14823a1c665af66110858-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/75661/1005606c3cc14823a1c665af66110858/2625e521c6444e44aaade2706b16dc93_e73b0c0ded0d4705accc2d46cb51d67f1201a_mw.jpeg
物品主要详细信息

状况:

Used


运行状况:

Installed / Idle


产品编号:

89447


晶圆尺寸:

未知


年份:

2018


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明
配置
CE and ESD N51M M24 compliant 150mm and 200mm wafer diameter processing capability with matching wafer tables Double loadport (2 FOUP loader with 8" mapping, no 6" mapping) BG-Tape cutting and wafer handling using 6-axis robot Non-contact alignment and tape lamination unit Log file download function via LAN Ionizers for ceiling and loadport Manual on paper and digital download in english Preparation for Wafer ID reading function for front side only (reader not included) SECS/GEM Specification (license fee, no customization) PP_SELECT data variable length (software function) Wafer ID reading as task parameter No. 43 (software function) SECS/GEM menu only accessible with PW (software function) Maintenance password "ADWILL2" Total counter reset with max. wafer count 999.999.999 Counter reset with password N2 purge during lamination Wafer thickness limit changed to 3000μm Wafer table cleaning unit Pneumatic tape winder Vacuum cleaner value display on Touchpanel
OEM 型号描述
未提供
文件

无文件