说明
无说明配置
De-taper, 4"-8" Wafer thickness: 300 - 1000 um Power supply: 110 V.OEM 型号描述
The HR-8500-II is a fully automatic type that can handle wafers up to 8". Equipped with a robot arm for wafer transfer and a CCD type non-contact aligner for wafer alignment, transferring wafers without generating dust. Easy operation is possible with a touch panel. Transfers large diameter wafers without generating dust. An ultraviolet irradiation device can be installed as an option文件
无文件
NITTO
HR 8500 II
已验证
类别
Packaging
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
65691
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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NITTO
HR 8500 II
类别
Packaging
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
65691
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
De-taper, 4"-8" Wafer thickness: 300 - 1000 um Power supply: 110 V.OEM 型号描述
The HR-8500-II is a fully automatic type that can handle wafers up to 8". Equipped with a robot arm for wafer transfer and a CCD type non-contact aligner for wafer alignment, transferring wafers without generating dust. Easy operation is possible with a touch panel. Transfers large diameter wafers without generating dust. An ultraviolet irradiation device can be installed as an option文件
无文件