说明
Depaneling system, 16" X 16" X 4.5" MAX, requires electricity and compressed air配置
Singulation Process 3016ATOEM 型号描述
As an extension of our tooling expertise, Larsen builds an elite punch and die based depaneling system for the printed circuit board industry. By greatly reducing and eliminating any stress or flex during the separation process of multiple populated PCB’s, the WAND Depaneling System safeguards against fractured joints and excess burrs, and leaves disjointed arrays quickly and cleanly separated. The WAND System is perfectly suited to accommodate medium to high volume PCB separation needs.文件
无文件
LARSEN
WAND
已验证
类别
PCB / SMT
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
59322
晶圆尺寸：
未知
年份：
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LARSEN
WAND
类别
PCB / SMT
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
59322
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
Depaneling system, 16" X 16" X 4.5" MAX, requires electricity and compressed air配置
Singulation Process 3016ATOEM 型号描述
As an extension of our tooling expertise, Larsen builds an elite punch and die based depaneling system for the printed circuit board industry. By greatly reducing and eliminating any stress or flex during the separation process of multiple populated PCB’s, the WAND Depaneling System safeguards against fractured joints and excess burrs, and leaves disjointed arrays quickly and cleanly separated. The WAND System is perfectly suited to accommodate medium to high volume PCB separation needs.文件
无文件