说明
无说明配置
3 DxZ Chambers w/ RPSOEM 型号描述
The Centura 5200 DXZ is used for advanced 150mm and 200mm CVD technology in the advanced CMOS and MtM segments. It can be used for ultra-thick oxides (≥20µm), low-temperature processing (<200°C), conformal, low wet-etch-rate films, and doped films with tunable refractive indices. The system can handle a variety of MtM substrates (including SiC wafers) reliably and carefully from load lock wafer mapping to clear wafer orientation to wafer placement.文件
无文件
类别
PECVD
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
15128
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA 5200 DXZ
类别
PECVD
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
15128
晶圆尺寸：
8"/200mm
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
3 DxZ Chambers w/ RPSOEM 型号描述
The Centura 5200 DXZ is used for advanced 150mm and 200mm CVD technology in the advanced CMOS and MtM segments. It can be used for ultra-thick oxides (≥20µm), low-temperature processing (<200°C), conformal, low wet-etch-rate films, and doped films with tunable refractive indices. The system can handle a variety of MtM substrates (including SiC wafers) reliably and carefully from load lock wafer mapping to clear wafer orientation to wafer placement.文件
无文件