说明
无说明配置
General Information Technology: DCVD Mainframe Type: Producer SE Year of Construction: 2003 Wafer Specification Wafer Size: 300mm Wafer Shape: SNNF Chamber Type/Location Chamber Type: SACVD Process Twin Chamber Location: Chamber A: SACVD Process Twin chamber Chamber B: SACVD Process Twin chamber Chamber C: Empty Electrical Conβiguration Voltage: 208V 3Phase 4Wires Frequency: 50/60 Hz Full load Current: 240 Amperes System Safety System Labels: English EMO Type: Turn to release General Mainframe Chamber Slit Valve: G67P Wafer in pocket sensor : LCF Buffer Robot Type : VHP robot VHP robot Driver: 0190-24962 NSK driver(ELA-B014CG7-04) VHP robot blade: 0200-06112 BLADE, CERAMIC, 300MM PRODUCER SE Factory Interface None Load Port Types : TDK Load Port 02TF12718 (0190-16691) x2 FI Robot Robot Type: ROBOT AA, KAWASAKI PRODUCER FI 300MM(0190-10301) Robot Driver: Kawasaki 30C61C-B004 Master A Robot Controller (0190-12379) Metrology Unit: None Ionizing System: E78 Ionizer Chamber Configuration Chamber Process : Chamber A--- SACVD Chamber B--- SACVD RF Generator: None End point detector: NA Process kits: Blocker Plate: 0021-25474 Faceplate: 0041-13896 GAS box: 0040-53688 LINER, CERAMIC MIDDLE, PMD SACVD 300MM : 0200-02525 PUMPING RING, PMD ETERNA, PRODUCER SE: 0020-31178 LINER, CERAMIC BOTTOM, SACVD 300MM PRODUCER: 0200-00668 Liner Ceramic Top Eterna: 0200-02414 ISOLATOR, CERAMIC, 300MM Producer : 0200-04235 300mm AMAT Producer Ceramic Heater: 0040-85475 Chamber Clean Method: Remote Plasma (RPS) Clean: (0920-00057) MKS F180131, ASTRON ex Remote Plasma source Gauge/ Monometer Configuration: 20Torr / 100Torr with 100 Torr 1/2 ATM Switch Pressure Control: Throttle valve Type: 3870-03394MKS Throttle Valve 683B-23795, Type 683 Control Valve Forline Valve: 3870-03322 VALVE GATE 3" ID NW57 PNEU N/C W/O POSIT Gas Delivery Options Gas Delivery Gas Pallet Type: Surface Mount Vertical Regulated Gas Panel Gas Feed :Top Gas Panel Cabinet Exhaust : Top Exhaust MFC Type: Unit UFC-8565 Gas Pallet Conβiguration Supplement Chamber A: Twin Ch. A Gas Name MFC Model MFC Size Factor Gas Line Stick Position #1 O2 MKP 15000 #2 #3 #4 #5 #6 N2 PURGE #7 NF3 Brooks 5000 #8 Ar Brooks 10000 #9 He MKP 15000 #10 N2 PURGE #L1 #L2 #L3 #R1 TEOS Horiba 7g/min #R2 #R3 Chamber B: Twin Ch. B Gas Name MFC Model MFC Size Factor Gas Line Stick Position #1 O2 MKP 15000 #2 #3 #4 #5 #6 N2 PURGE #7 NF3 Brooks 5000 #8 Ar Brooks 10000 #9 He MKP 15000 #10 N2 PURGE #L1 #L2 #L3 #R1 TEOS Horiba 7g/min #R2 #R3 Remotes Options System Monitors : Local Monitors Standalone with 1st and 2nd monitors Heat Exchanger/Chiller: NA Remote AC : Facilities UPS InterfaceOEM 型号描述
The Applied Materials PRODUCER SE is a chemical vapor deposition (CVD) system manufactured by Applied Materials, Inc. It is designed for depositing thin films onto semiconductor wafers in the semiconductor manufacturing process.文件
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APPLIED MATERIALS (AMAT)
PRODUCER SE
已验证
类别
PECVD
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
107909
晶圆尺寸：
12"/300mm
年份：
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
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Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
PRODUCER SE
类别
PECVD
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
107909
晶圆尺寸：
12"/300mm
年份：
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
General Information Technology: DCVD Mainframe Type: Producer SE Year of Construction: 2003 Wafer Specification Wafer Size: 300mm Wafer Shape: SNNF Chamber Type/Location Chamber Type: SACVD Process Twin Chamber Location: Chamber A: SACVD Process Twin chamber Chamber B: SACVD Process Twin chamber Chamber C: Empty Electrical Conβiguration Voltage: 208V 3Phase 4Wires Frequency: 50/60 Hz Full load Current: 240 Amperes System Safety System Labels: English EMO Type: Turn to release General Mainframe Chamber Slit Valve: G67P Wafer in pocket sensor : LCF Buffer Robot Type : VHP robot VHP robot Driver: 0190-24962 NSK driver(ELA-B014CG7-04) VHP robot blade: 0200-06112 BLADE, CERAMIC, 300MM PRODUCER SE Factory Interface None Load Port Types : TDK Load Port 02TF12718 (0190-16691) x2 FI Robot Robot Type: ROBOT AA, KAWASAKI PRODUCER FI 300MM(0190-10301) Robot Driver: Kawasaki 30C61C-B004 Master A Robot Controller (0190-12379) Metrology Unit: None Ionizing System: E78 Ionizer Chamber Configuration Chamber Process : Chamber A--- SACVD Chamber B--- SACVD RF Generator: None End point detector: NA Process kits: Blocker Plate: 0021-25474 Faceplate: 0041-13896 GAS box: 0040-53688 LINER, CERAMIC MIDDLE, PMD SACVD 300MM : 0200-02525 PUMPING RING, PMD ETERNA, PRODUCER SE: 0020-31178 LINER, CERAMIC BOTTOM, SACVD 300MM PRODUCER: 0200-00668 Liner Ceramic Top Eterna: 0200-02414 ISOLATOR, CERAMIC, 300MM Producer : 0200-04235 300mm AMAT Producer Ceramic Heater: 0040-85475 Chamber Clean Method: Remote Plasma (RPS) Clean: (0920-00057) MKS F180131, ASTRON ex Remote Plasma source Gauge/ Monometer Configuration: 20Torr / 100Torr with 100 Torr 1/2 ATM Switch Pressure Control: Throttle valve Type: 3870-03394MKS Throttle Valve 683B-23795, Type 683 Control Valve Forline Valve: 3870-03322 VALVE GATE 3" ID NW57 PNEU N/C W/O POSIT Gas Delivery Options Gas Delivery Gas Pallet Type: Surface Mount Vertical Regulated Gas Panel Gas Feed :Top Gas Panel Cabinet Exhaust : Top Exhaust MFC Type: Unit UFC-8565 Gas Pallet Conβiguration Supplement Chamber A: Twin Ch. A Gas Name MFC Model MFC Size Factor Gas Line Stick Position #1 O2 MKP 15000 #2 #3 #4 #5 #6 N2 PURGE #7 NF3 Brooks 5000 #8 Ar Brooks 10000 #9 He MKP 15000 #10 N2 PURGE #L1 #L2 #L3 #R1 TEOS Horiba 7g/min #R2 #R3 Chamber B: Twin Ch. B Gas Name MFC Model MFC Size Factor Gas Line Stick Position #1 O2 MKP 15000 #2 #3 #4 #5 #6 N2 PURGE #7 NF3 Brooks 5000 #8 Ar Brooks 10000 #9 He MKP 15000 #10 N2 PURGE #L1 #L2 #L3 #R1 TEOS Horiba 7g/min #R2 #R3 Remotes Options System Monitors : Local Monitors Standalone with 1st and 2nd monitors Heat Exchanger/Chiller: NA Remote AC : Facilities UPS InterfaceOEM 型号描述
The Applied Materials PRODUCER SE is a chemical vapor deposition (CVD) system manufactured by Applied Materials, Inc. It is designed for depositing thin films onto semiconductor wafers in the semiconductor manufacturing process.文件
无文件