说明
无说明配置
General Information Technology: DCVD Mainframe Type: Producer SE Year of Construction: 2003 Wafer Specification Wafer Size: 300mm Wafer Shape: SNNF Chamber Type/Location Chamber Type: SACVD Process Twin Chamber Location: Chamber A: SACVD Process Twin chamber Chamber B: SACVD Process Twin chamber Chamber C: Empty Electrical Conβiguration Voltage: 208V 3Phase 4Wires Frequency: 50/60 Hz Full load Current: 240 Amperes System Safety System Labels: English EMO Type: Turn to release General Mainframe Chamber Slit Valve: G67P Wafer in pocket sensor : LCF Buffer Robot Type : VHP robot VHP robot Driver: 0190-24962 NSK driver(ELA-B014CG7-04) VHP robot blade: 0200-06112 BLADE, CERAMIC, 300MM PRODUCER SE Factory Interface None Load Port Types : TDK Load Port 02TF12718 (0190-16691) x2 FI Robot Robot Type: ROBOT AA, KAWASAKI PRODUCER FI 300MM(0190-10301) Robot Driver: Kawasaki 30C61C-B004 Master A Robot Controller (0190-12379) Metrology Unit: None Ionizing System: E78 Ionizer Chamber Configuration Chamber Process : Chamber A--- SACVD Chamber B--- SACVD RF Generator: None End point detector: NA Process kits: Blocker Plate: 0021-25474 Faceplate: 0041-13896 GAS box: 0040-53688 LINER, CERAMIC MIDDLE, PMD SACVD 300MM : 0200-02525 PUMPING RING, PMD ETERNA, PRODUCER SE: 0020-31178 LINER, CERAMIC BOTTOM, SACVD 300MM PRODUCER: 0200-00668 Liner Ceramic Top Eterna: 0200-02414 ISOLATOR, CERAMIC, 300MM Producer : 0200-04235 300mm AMAT Producer Ceramic Heater: 0040-85475 Chamber Clean Method: Remote Plasma (RPS) Clean: (0920-00057) MKS F180131, ASTRON ex Remote Plasma source Gauge/ Monometer Configuration: 20Torr / 100Torr with 100 Torr 1/2 ATM Switch Pressure Control: Throttle valve Type: 3870-03394MKS Throttle Valve 683B-23795, Type 683 Control Valve Forline Valve: 3870-03322 VALVE GATE 3" ID NW57 PNEU N/C W/O POSIT Gas Delivery Options Gas Delivery Gas Pallet Type: Surface Mount Vertical Regulated Gas Panel Gas Feed :Top Gas Panel Cabinet Exhaust : Top Exhaust MFC Type: Unit UFC-8565 Gas Pallet Conβiguration Supplement Chamber A: Twin Ch. A Gas Name MFC Model MFC Size Factor Gas Line Stick Position #1 O2 MKP 15000 #2 #3 #4 #5 #6 N2 PURGE #7 NF3 Brooks 5000 #8 Ar Brooks 10000 #9 He MKP 15000 #10 N2 PURGE #L1 #L2 #L3 #R1 TEOS Horiba 7g/min #R2 #R3 Chamber B: Twin Ch. B Gas Name MFC Model MFC Size Factor Gas Line Stick Position #1 O2 MKP 15000 #2 #3 #4 #5 #6 N2 PURGE #7 NF3 Brooks 5000 #8 Ar Brooks 10000 #9 He MKP 15000 #10 N2 PURGE #L1 #L2 #L3 #R1 TEOS Horiba 7g/min #R2 #R3 Remotes Options System Monitors : Local Monitors Standalone with 1st and 2nd monitors Heat Exchanger/Chiller: NA Remote AC : Facilities UPS InterfaceOEM 型号描述
The Applied Materials PRODUCER SE is a chemical vapor deposition (CVD) system manufactured by Applied Materials, Inc. It is designed for depositing thin films onto semiconductor wafers in the semiconductor manufacturing process.文件
无文件
类别
PECVD
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
107909
晶圆尺寸：
12"/300mm
年份：
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
PRODUCER SE
类别
PECVD
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
107909
晶圆尺寸：
12"/300mm
年份：
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
General Information Technology: DCVD Mainframe Type: Producer SE Year of Construction: 2003 Wafer Specification Wafer Size: 300mm Wafer Shape: SNNF Chamber Type/Location Chamber Type: SACVD Process Twin Chamber Location: Chamber A: SACVD Process Twin chamber Chamber B: SACVD Process Twin chamber Chamber C: Empty Electrical Conβiguration Voltage: 208V 3Phase 4Wires Frequency: 50/60 Hz Full load Current: 240 Amperes System Safety System Labels: English EMO Type: Turn to release General Mainframe Chamber Slit Valve: G67P Wafer in pocket sensor : LCF Buffer Robot Type : VHP robot VHP robot Driver: 0190-24962 NSK driver(ELA-B014CG7-04) VHP robot blade: 0200-06112 BLADE, CERAMIC, 300MM PRODUCER SE Factory Interface None Load Port Types : TDK Load Port 02TF12718 (0190-16691) x2 FI Robot Robot Type: ROBOT AA, KAWASAKI PRODUCER FI 300MM(0190-10301) Robot Driver: Kawasaki 30C61C-B004 Master A Robot Controller (0190-12379) Metrology Unit: None Ionizing System: E78 Ionizer Chamber Configuration Chamber Process : Chamber A--- SACVD Chamber B--- SACVD RF Generator: None End point detector: NA Process kits: Blocker Plate: 0021-25474 Faceplate: 0041-13896 GAS box: 0040-53688 LINER, CERAMIC MIDDLE, PMD SACVD 300MM : 0200-02525 PUMPING RING, PMD ETERNA, PRODUCER SE: 0020-31178 LINER, CERAMIC BOTTOM, SACVD 300MM PRODUCER: 0200-00668 Liner Ceramic Top Eterna: 0200-02414 ISOLATOR, CERAMIC, 300MM Producer : 0200-04235 300mm AMAT Producer Ceramic Heater: 0040-85475 Chamber Clean Method: Remote Plasma (RPS) Clean: (0920-00057) MKS F180131, ASTRON ex Remote Plasma source Gauge/ Monometer Configuration: 20Torr / 100Torr with 100 Torr 1/2 ATM Switch Pressure Control: Throttle valve Type: 3870-03394MKS Throttle Valve 683B-23795, Type 683 Control Valve Forline Valve: 3870-03322 VALVE GATE 3" ID NW57 PNEU N/C W/O POSIT Gas Delivery Options Gas Delivery Gas Pallet Type: Surface Mount Vertical Regulated Gas Panel Gas Feed :Top Gas Panel Cabinet Exhaust : Top Exhaust MFC Type: Unit UFC-8565 Gas Pallet Conβiguration Supplement Chamber A: Twin Ch. A Gas Name MFC Model MFC Size Factor Gas Line Stick Position #1 O2 MKP 15000 #2 #3 #4 #5 #6 N2 PURGE #7 NF3 Brooks 5000 #8 Ar Brooks 10000 #9 He MKP 15000 #10 N2 PURGE #L1 #L2 #L3 #R1 TEOS Horiba 7g/min #R2 #R3 Chamber B: Twin Ch. B Gas Name MFC Model MFC Size Factor Gas Line Stick Position #1 O2 MKP 15000 #2 #3 #4 #5 #6 N2 PURGE #7 NF3 Brooks 5000 #8 Ar Brooks 10000 #9 He MKP 15000 #10 N2 PURGE #L1 #L2 #L3 #R1 TEOS Horiba 7g/min #R2 #R3 Remotes Options System Monitors : Local Monitors Standalone with 1st and 2nd monitors Heat Exchanger/Chiller: NA Remote AC : Facilities UPS InterfaceOEM 型号描述
The Applied Materials PRODUCER SE is a chemical vapor deposition (CVD) system manufactured by Applied Materials, Inc. It is designed for depositing thin films onto semiconductor wafers in the semiconductor manufacturing process.文件
无文件