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APPLIED MATERIALS (AMAT) PRODUCER GT CELERA
  • APPLIED MATERIALS (AMAT) PRODUCER GT CELERA
  • APPLIED MATERIALS (AMAT) PRODUCER GT CELERA
  • APPLIED MATERIALS (AMAT) PRODUCER GT CELERA
说明
HDD included
配置
3CH
OEM 型号描述
The Applied Producer Celera PECVD system offers industry-standard tunable compressive and tensile high-stress silicon nitride films for strain engineering applications at advanced nodes. The system offers an integrated stress nitride deposition and UV cure that delivers tensile stress of up to 1.7GPa, while meeting low thermal budget requirements. The same chamber can deposit films with compressive stresses up to 3.5 GPa with extended RF capability. The process utilizes production-proven silane CVD technology to deliver superior step coverage (70%) and high-quality film with low hydrogen content while retaining excellent SiN etch-stop properties and pattern-loading results. The Applied Celera deposition and UV cure processes are integrated on the production-proven, high-throughput Producer platform with its flexible Twin Chamber® configuration and platform extendibility that enables customers to leverage the Producer toolset for multiple process nodes.
文件

无文件

类别
PECVD

上次验证: 30 多天前

物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

127112


晶圆尺寸:

未知


年份:

未知


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

APPLIED MATERIALS (AMAT)

PRODUCER GT CELERA

verified-listing-icon
已验证
类别
PECVD
上次验证: 30 多天前
listing-photo-2f7db65652a94a1d96acb573238e720f-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
物品主要详细信息

状况:

Used


运行状况:

未知


产品编号:

127112


晶圆尺寸:

未知


年份:

未知


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
HDD included
配置
3CH
OEM 型号描述
The Applied Producer Celera PECVD system offers industry-standard tunable compressive and tensile high-stress silicon nitride films for strain engineering applications at advanced nodes. The system offers an integrated stress nitride deposition and UV cure that delivers tensile stress of up to 1.7GPa, while meeting low thermal budget requirements. The same chamber can deposit films with compressive stresses up to 3.5 GPa with extended RF capability. The process utilizes production-proven silane CVD technology to deliver superior step coverage (70%) and high-quality film with low hydrogen content while retaining excellent SiN etch-stop properties and pattern-loading results. The Applied Celera deposition and UV cure processes are integrated on the production-proven, high-throughput Producer platform with its flexible Twin Chamber® configuration and platform extendibility that enables customers to leverage the Producer toolset for multiple process nodes.
文件

无文件