说明
无说明配置
Chemical Vapour Depositioning (CVD - Single)OEM 型号描述
VECTOR Q Strata is a product in the VECTOR family of Lam Research Corporation. It is designed to provide the performance and flexibility needed to create enabling structures and meet the demands of challenging applications in the semiconductor industry. The VECTOR family uses Plasma-Enhanced Chemical Vapor Deposition (PECVD) and Plasma-Enhanced Atomic Layer Deposition (ALD) technologies to deposit high-quality dielectric films that meet exacting thickness, feature coverage, and stress, electrical, and mechanical requirements. The VECTOR Q Strata offers superior thin film quality, exceptional wafer-to-wafer uniformity, best-in-class productivity, low cost of ownership, and broad process flexibility enabled by Multi-Station Sequential Deposition (MSSD) architecture. It also features proprietary technology for controlling wafer heat-up independent of film deposition, improving film quality and reducing processing time.文件
无文件
类别
PECVD
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
129800
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / NOVELLUS
VECTOR Q STRATA
类别
PECVD
上次验证： 60 多天前
物品主要详细信息
状况：
Used
运行状况:
未知
产品编号：
129800
晶圆尺寸：
未知
年份：
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
说明
无说明配置
Chemical Vapour Depositioning (CVD - Single)OEM 型号描述
VECTOR Q Strata is a product in the VECTOR family of Lam Research Corporation. It is designed to provide the performance and flexibility needed to create enabling structures and meet the demands of challenging applications in the semiconductor industry. The VECTOR family uses Plasma-Enhanced Chemical Vapor Deposition (PECVD) and Plasma-Enhanced Atomic Layer Deposition (ALD) technologies to deposit high-quality dielectric films that meet exacting thickness, feature coverage, and stress, electrical, and mechanical requirements. The VECTOR Q Strata offers superior thin film quality, exceptional wafer-to-wafer uniformity, best-in-class productivity, low cost of ownership, and broad process flexibility enabled by Multi-Station Sequential Deposition (MSSD) architecture. It also features proprietary technology for controlling wafer heat-up independent of film deposition, improving film quality and reducing processing time.文件
无文件